In addition, with the low profiling of the copper core with its "EOMIN" features, Taiyo Yuden's conventional substrate thickness has been reduced by about 20% - from 0.48mm to 0.38mm - further contributing to the development of low profile smartphones.
The Japanese company plans to further develop ts technology towards the miniaturization of low profile devices.
An improvement in tolerance to noise due to the shielding effect from the copper core
Highly heat radiation
The high thermal conductivity of the copper core effectively dissipates heat coming from IC chips, etc.
Constructed with a built-in copper core, the rigidity of the module itself is increased
Jointed with embedded parts by electrolytic copper plating