VIA Technologies launched the VIA Edge AI Developer Kit, a package powered by the Qualcomm Snapdragon 820E Embedded Platform designed for the design, testing, and deployment of intelligent Edge AI systems and devices.

The kit combines the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis. Edge AI application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of the Qualcomm Hexagon DSP, Qualcomm Adreno 530 GPU, or Qualcomm Kryo CPU to power AI applications. A Linux BSP based on Yocto 2.0.3 is set to be released in June this year.

The VIA SOM-9X20 system-on-module is measuring just 8.2cm x 4.5cm, the module features 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO.

The VIA Edge AI Developer Kit is available in two configurations from the VIA Embedded online store at:

• VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module (COB 1/3.06" 4224x3136 pixels): US$629 plus shipping
• VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board: US$569 plus shipping
• Optional 10.1" MIPI LCD touch panel: US$179 plus shipping.