Yangtze Memory to Release its 128-layer 3D NAND This Year
Yangtze Memory is still on track to launch its most advanced 128-layer 3D NAND this year, despite the delays in the research and development progress at the company's facilities in Wuhan due to the coronavirus.
Wuhan has officially lifted the lockdown after the new coronavirus outbreak, and according to the Securities Times, Yangtze Memory CEO Yang Shining said that the research and development progress of Yangtze Memory’s most advanced 128-layer 3D NAND technology was only temporarily affected. He added that Yangtze Memory has fully resumed operations and that the company's 128-layer technology will be launched as planned in 2020.
Founded in July 2016, Yangtze Memory shoulders is essentially responsible for the Chinese memory production. The company provides 3D NAND wafer, die, and solutions including embedded memory, cSSD, and eSSD for a wide range of applications including mobile devices, PCs, and data centers.
In October 2017, YMTC designed and manufactured China's first 3D NAND flash memory by combining independent R&D and international cooperation. In September 2019, 64-layer TLC 3D NAND flash memory based on the Xtacking architecture entered mass production.
On January 16, 2020, at the annual meeting of market partners held by Yangtze Memory, Yang Shining stated that Yangtze Memory had planned to provide embedded storage, solid-state drive (SSD) and other products.