Breaking News

COLORFUL Launches EVOL X15 AT Gaming Laptop Powered by Intel 13th Gen CPUs and NVIDIA GeForce RTX 4060 GPU Thermaltake at Computex 2023 Dirac Deepens Collaboration with ASUS to Equip Latest Smartphones and Laptops with Industry-Leading Immersive Sound Experiences Sony Announces New High-Performance M Series CFexpress Type A Memory Cards be quiet! introduces new premium products at Computex 2023

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

SK hynix Licenses Xperi's DBI Ultra 3D Interconnect Technology For Next-Generation Memory

SK hynix Licenses Xperi's DBI Ultra 3D Interconnect Technology For Next-Generation Memory

Enterprise & IT Feb 12,2020 0

Xperi Corp. has entered into a new patent and technology license agreement with SK hynix, offering the South Korean semiconductor manufacturer access to Xperi’s portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.

The terms and conditions of the agreement are confidential.

DBI Ultra is a patented die-to-wafer hybrid bonding 3D interconnect technology platform designed for homogeneous and heterogeneous 3D integration. By eliminating the need for copper pillars and underfill, DBI Ultra can enable a thinner stack than conventional approaches. DBI Ultra also allows the stacking of die that are the same or different sizes, processed on fine or coarse wafer process technology nodes, or manufactured on the same or different wafer sizes while readily scaling down to 1 µm interconnect pitch providing 2.5D and 3D integration flexibility. Among a wide range of applications, DBI Ultra makes it possible to manufacture 8-, 12- and even 16-high chip stacks while meeting the packaging height and performance requirements for high-performance computing.

DBI wafer-to-wafer hybrid bonding, the predecessor to DBI Ultra, supports from 100,000 to 1,000,000 interconnects per mm2, using interconnect pitches as small as 1 µm. According to the company, the much greater number of interconnects can offer dramatically increased bandwidth compared to conventional copper pillar interconnect technology, which only goes as high as 625 interconnects per mm2. The small interconnects also offer a shorter z-height, making it possible to build a stacked chip with 16 layers in the same space as conventional 8-Hi chips, allowing for greater memory densities.

DBI Ultra uses a chemical bond that allows for interconnect layers that add no stand-off height, and require no copper pillars or underfill. While the process flow used for DBI Ultra is different when compared to conventional stacking processes, it continues to involve known good dies and does not require high temperatures, which results in relatively high yields.

DBI Ultra is already incorporated into image sensors and RF components shipping in hundreds of millions of smartphones around the world. DBI Ultra is poised to realize similar success in 3D stacked memory as well as in 2.5D and 3D applications requiring the integration of memory with CPUs, GPUs, FPGAs, or SoCs.

Tags: SK Hynix3D NAND
Previous Post
Fujitsu's AI Image Analysis Solution Evaluates Digital Signage User Experience
Next Post
The New Nikon D6 Flagship Camera Coming in April

Related Posts

  • SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM

  • SK hynix Develops Industry’s First 12-Layer HBM3

  • SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T

  • SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel Xeon Scalable Processor

  • SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023

  • SK hynix Develops MCR DIMM – World’s Fastest Server Memory Module

  • SK hynix to Build M15X Fab in Cheongju

  • SK hynix Develops World’s Highest 238-Layer 4D NAND Flash

Latest News

COLORFUL Launches EVOL X15 AT Gaming Laptop Powered by Intel 13th Gen CPUs and NVIDIA GeForce RTX 4060 GPU
Gaming

COLORFUL Launches EVOL X15 AT Gaming Laptop Powered by Intel 13th Gen CPUs and NVIDIA GeForce RTX 4060 GPU

Thermaltake at Computex 2023
PC components

Thermaltake at Computex 2023

Dirac Deepens Collaboration with ASUS to Equip Latest Smartphones and Laptops with Industry-Leading Immersive Sound Experiences
Smartphones

Dirac Deepens Collaboration with ASUS to Equip Latest Smartphones and Laptops with Industry-Leading Immersive Sound Experiences

Sony Announces New High-Performance M Series CFexpress Type A Memory Cards
Cameras

Sony Announces New High-Performance M Series CFexpress Type A Memory Cards

be quiet! introduces new premium products at Computex 2023
PC components

be quiet! introduces new premium products at Computex 2023

Popular Reviews

Pioneer BDR-S13U-X Blu-Ray Recorder

Pioneer BDR-S13U-X Blu-Ray Recorder

Pioneer BDR-X13U-S

Pioneer BDR-X13U-S

EnGenius ECW230S AP

EnGenius ECW230S AP

Pioneer BDR-XD08UMB-S External Blu-Ray Recorder

Pioneer BDR-XD08UMB-S External Blu-Ray Recorder

be quiet! Pure Rock 2 FX

be quiet! Pure Rock 2 FX

be quiet! Pure Loop 2 FX (280mm)

be quiet! Pure Loop 2 FX (280mm)

Creative Zen Hybrid

Creative Zen Hybrid

be quiet! Silent Wings Pro 4

be quiet! Silent Wings Pro 4

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed