Phison Electronics' control chips will support China's Yangtze Memory's 3D NAND, the company announced.

Phison Electronics and Yangtze Memory have been working together since 2016. From the earliest 32-layer 3D NAND import verification PhisoneMMC control chip PS8226 to the recent 64-layer 3D NAND, Phison's full range of NAND control chips are supported and have entered the mass production stage.

For example, the high-end PCIe SSD controller PS5012, SATA SSD controller PS3112, UFS controller PS8318, and eMMC controller PS8229 for high-speed mobile device storage, the recently discussed NM Card (NanoMemory Card) controller PS8229, and SD and USB controller for consumer applications, all support Yangtze Memory's 64-layer 3D NAND.

Although Yangtze Memory (YMTC) is a newcomer to the NAND Flash industry, the quality of its products has been proven and recognized in specific application markets, and there is an opportunity for its popularity in various storage applications," said Phison Chairman Pan Jiancheng.

He said Phison Electronics, the world's largest independent flash control chip and storage solution integrator, will also gradually deepen its partnership with Yangtze Memory.

In addition to the 64-layer 3D NAND, Phison has also begun arranging for the R&D team to work on supporting Yangtze Memory's recently announced 128-layer 3D NAND.

In the storage application market, Phison will also work with Yangtze Memory to start with consumer storage applications, and gradually expand to industrial embedded systems and enterprise servers and other high-end storage applications.