VIA Mobile-ITX Brings Further Miniaturization to Embedded Devices
Via Technologies is pursuing ultra-small designs with the official release of the compact, 6cm x 6cm Mobile-ITX form factor computer-on-module board for next-generation embedded devices.
The Mobile-ITX is the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.
Mobile-ITX addresses the need for a simple, modular approach to portable IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a flexible feature set.
"With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "Mobile-ITX enables the creation of a new breed of ultra-compact, portable networked devices suitable for a range of applications, particularly in modern medical and military segments."
Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-module form factor on the market, a 50% smaller than the successful VIA-developed Pico-ITX form factor.
Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers flexibility for developers who can simply drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design and testing phases.
CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. Mobile-ITX-based modules consume as little as 5 watts, ideal for always-on, mission critical systems.
The CPU module I/O signals are mapped to two unique high density, low profile connectors on the under side of the module, with a distance between the CPU module and the baseboard of only 3mm, making it ideal for ultra-slim system designs. The connectors can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.
Mobile-ITX addresses the need for a simple, modular approach to portable IPC design, making it easier than ever to bring to market ultra-compact and lightweight devices that offer comprehensive connectivity options and a flexible feature set.
"With Mobile-ITX we have again pushed back the barriers that limit just how small an embedded industrial PC can be," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "Mobile-ITX enables the creation of a new breed of ultra-compact, portable networked devices suitable for a range of applications, particularly in modern medical and military segments."
Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-module form factor on the market, a 50% smaller than the successful VIA-developed Pico-ITX form factor.
Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers flexibility for developers who can simply drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design and testing phases.
CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. Mobile-ITX-based modules consume as little as 5 watts, ideal for always-on, mission critical systems.
The CPU module I/O signals are mapped to two unique high density, low profile connectors on the under side of the module, with a distance between the CPU module and the baseboard of only 3mm, making it ideal for ultra-slim system designs. The connectors can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
The VIA Embedded Platform Division will announce the first commercial CPU module based on the Mobile-ITX form factor in Q1 2010.
