"IBM and GLOBALFOUNDRIES are committed to pushing forward the leading-edge of IC logic manufacturing with new materials and device structures," said Gary Patton, VP Semiconductor Research for IBM. "Intermolecular's HPC technology will help to more rapidly explore materials and processing options for advanced logic manufacturing."
"We are pleased that IBM and GLOBALFOUNDRIES will be able to leverage our HPC platform to address GLOBALFOUNDRIES' high-volume manufacturing R&D challenges," said David Lazovsky, Intermolecular president and CEO.
"Our business model is built on collaboration, both in customer engagements and technology development," commented David Bennett, vice president of alliances for GLOBALFOUNDRIES. "Collaborating with Intermolecular has strengthened our R&D pipeline and improved R&D efficiency."