GLOBALFOUNDRIES and SiFive, Inc. are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF’s 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications.

The announcement was made at the GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan,

In order to achieve the capacity and bandwidth for data-intensive AI training applications, system designers are challenged with squeezing more bandwidth into a smaller area while maintaining a reasonable power profile. SiFive’s customizable high bandwidth memory interface on GF’s 12LP platform and 12LP+ solution will enable easy integration of high bandwidth memory into a single System-on-Chip (SoC) solutions.

As a part of the collaboration, designers will also have access to SiFive’s RISC-V IP portfolio and DesignShare IP ecosystem, which will leverage GF’s 12LP+ Design Technology Co-Optimization (DTCO).

SiFive’s HBM2E interface and custom IP solution on GF’s 12LP and 12LP+ are now under development at GF’s Fab 8 in Malta, New York.