Through the project, the two companies developed technology for forming, processing and evaluating a new ferroelectric (PZT) film and created FRAM memory core process technology that is highly integrated (four times the level of conventional FRAM), features high performance (read/write speeds over three times faster than conventional FRAM) and boasts high reliability (capable of more than one hundred trillion read/write cycles). FRAM is currently attracting attention as a cutting-edge technology for secure memory, and this level of performance is a world first. Since the ferroelectric process can be added to existing CMOS logic processes, it will be suitable for the development of mass production technologies.
Epson intends to combine the results of this joint project with its own low power consumption CMOS technology to further speed up development and commercialization of integrated large-scale integrated circuits (LSIs) for applications such as battery-operated and portable devices.
Fujitsu will proceed with development of mass production technologies based on the results of this joint project.