Breaking News

SAMA Expands CPU Cooling Lineup with A60 and A40 Series Air Coolers for Gaming and Creator PCs The Lockerstor 12R Pro Gen2 and 16R Pro Gen2 are Here! TRUSTA Highlights SSD Power Efficiency for AI Servers at OCP APAC 2025 XPG Launches VALOR NANO Compact Cases with the All-New PYMCORE SFX PSU Speedlink announces illuminated mechanical 60% gaming keyboard

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

VIA enters license agreement with 3Com

VIA enters license agreement with 3Com

Enterprise & IT Nov 12,2004 0

VIA Technologies and 3Com Corporation today announced that the two companies have entered into a patent license agreement that grants VIA rights under certain 3Com patents. This agreement covers the licensing of specified 10/100 Ethernet controller chips developed and sold by VIA and its subsidiaries.

?Networking products constitute a key element of our platform strategy, comprising a broad range of discrete and integrated Ethernet-controller solutions for ultimate flexibility for our customers,? said Steven Lee, Executive Assistant to VIA president and CEO Wen-Chi Chen. ?This agreement with 3Com strengthens our ability to compete and provides our customers with an edge in this marketplace, enabling us to offer industry-leading technology as part of our portfolio,? added Lee.

While the specific terms of the license are confidential, the agreement covers past and future sales of VIA's licensed products. Under the terms of the agreement, VIA will make on-going royalty payments based on future sales.

Tags: VIA
Previous Post
Microsoft disputes SP2 hole claims
Next Post
Sandwich clusters may improve magnetic memory storage

Related Posts

  • VIA Launches the VIA Mobile360 M810 System

  • VIA Launches VIA Edge AI Developer Kit Powered by Qualcomm Snapdragon 820E Embedded Platform

  • VIA Launches VPai Slide 360-Degree Video Camera Platform

  • VIA Launches ARTiGO A900 Android System For IoT and M2M Deployments

  • VIA Now Offers New Viega Ruggedized Android Tablet

  • VIA Releases New AMOS-3003 Fanless System

  • VIA Sues Asus Group Companies and Executives for Damages in Trade Secrets Misappropriation Suit

  • VIA Announces New Fanless Quad Core ARM-Based Industrial System

Latest News

SAMA Expands CPU Cooling Lineup with A60 and A40 Series Air Coolers for Gaming and Creator PCs
Cooling Systems

SAMA Expands CPU Cooling Lineup with A60 and A40 Series Air Coolers for Gaming and Creator PCs

The Lockerstor 12R Pro Gen2 and 16R Pro Gen2 are Here!
Enterprise & IT

The Lockerstor 12R Pro Gen2 and 16R Pro Gen2 are Here!

TRUSTA Highlights SSD Power Efficiency for AI Servers at OCP APAC 2025
Enterprise & IT

TRUSTA Highlights SSD Power Efficiency for AI Servers at OCP APAC 2025

XPG Launches VALOR NANO Compact Cases with the All-New PYMCORE SFX PSU
Cooling Systems

XPG Launches VALOR NANO Compact Cases with the All-New PYMCORE SFX PSU

Speedlink announces illuminated mechanical 60% gaming keyboard
PC components

Speedlink announces illuminated mechanical 60% gaming keyboard

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

be quiet! Pure Base 501

be quiet! Pure Base 501

Terramaster F8-SSD

Terramaster F8-SSD

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed