Taiwan Semiconductor Manufacturing Company (TSMC) is expected to start volume production of chips built using an enhanced 7nm with EUV node at the end of March.
The world's largest chip maker has already bought 18 EUV systems from ASML, according to t Digitimes.com report. ASML plans to ship a total of 30 EUV systems in 2019,
TSMC is also on track to move a newer 5nm node to risk production in the second quarter of 2019. The foundry will fully incorporate EUV in the 5nm node.
TSMC CEO CC Wei disclosed previously the foundry expects to start taping out 5nm chip designs later in the first half of 2019 and move the node to volume production in the first half of 2020.
TSMC 's 7nm chip client portfolio includes chip designs for applications such as HPC and automotive.
TSMC started volume producing 7nm chips in April 2018, with AMD, Apple, HiSilicon and Xilinx reportedly being among its major 7nm chip customers. The foundry will soon roll out its EUV-based 7nm process, which will boost its total 7nm chip sales to account for 25% of total wafer sales this year compared with 9% in 2018.