The Blade Series heatspreader aims to enhance heat dissipation to improve the longevity and stability of the modules while keeping a low profile. The new propriety design has numerous channels that increase the surface area to more efficiently offload heat away from the memory chips and PCB.
Blade 2000 modules will be showcased at the upcoming CES 2009 show, and will be available shortly afterwards.
Available in 6GB (3x2048) Triple Channel Optimized Kits
240 Pin DIMM
Pure Aluminum Heatsink
OCZ Lifetime Warranty
6GB (3x2048) T/C Kit PN - OCZ3B2000LV6GK