GLOBALFOUNDRIES is working with Brion to ensure that their foundry customers have a cost effective semiconductor manufacturing capability available. Critical to achieving this is the use of Tachyon Flex, which is the platform architecture that allows the Tachyon applications to run on a customer's existing compute cluster, distributed across many thousands of CPU cores.
"At 28nm and below it is necessary to explore and realize every possible process window improvement to achieve a manufacturable patterning solution," said Chris Spence, Senior Fellow of GLOBALFOUNDRIES. "We have found that Brion's OPC and Computational Lithography solutions enable us to achieve this goal and ensure the best possible yield for GLOBALFOUNDRIES' customers."
In integrated circuits design, tape-out or tapeout is the final part of the design cycle before a photomask is manufactured. In its current practice (also known as 'mask data preparation' or MDP) chip makers perform checks and make modifications to the mask design specific to the manufacturing process. Optical proximity correction (OPC) is the most common example, which corrects for the diffraction and interference behavior of light when printing the sub-micron scale features of modern integrated circuit designs.