AMD today introduced the long awaited Ryzen 7000 CPU and several new chipsets to support the new AM5 platform.

The s Ryzen 7000 series will support PCIe Gen5 standard and DDR5 memory technology. The LGA1718 socket will continue to be compatible with AM4 cooling that fixes compatibility issues. The next-generation AM5 socket will support up to 170W TDP and will be introduced with several new chipsets/motherboards (X670E, X670, and B650).

AMD slide-show supports that single-thread performance will be up to 15% higher since CPUs will have double the L2 cache on board, with 1 MB. CPU clocks are also boosted with higher than 5GHZ frequencies. Its expected that the new chips are made up of two 5nm Zen4 chiplets (holding 8 cores each) and one 6nm I/O. The Zen4 desktop CPUs will include a rdna2-GPU that for sure will please users not be able to buy GPUs. The RDNA2 iGPU can output images via up to four HDMI 2.1 and DisplayPort 2 outputs, and it decodes AV1 in hardware.

In a Blender demo AMD demonstrated a Intel Core i9-12900K and new Ryzen 7000 with 16 cores, with 204 seconds processing time for AMD is a thrid faster compared to the 297 seconds for Intels in the presented render test. This is one of the strengths of all AMD CPUs.

The new desktop Ryzen 7000 series is expected to ship 'this fall,' no specific date has been announced.

Apart from the CPUs, new chipsets are needed also. The AMD AM5 platform comes with a new LGA 1718 socket and new chipsets. The platform can support 24 PCIe 5.0 lanes, 16 for the video card, four for an M.2 slot, and four more for the connection to the chipset. The most opulent X670E chipset, where the E stands for 'Extreme,' can support two video card ports and an M.2 slot for an SSD with PCIe 5.0 bandwidth. Only the SSD on the B650 operates at PCIe 5.0 speeds. The motherboards that are a part of the 600 series will include up to 24 PCIe Gen5 lanes for storage and graphics, 14 SuperSpeed USB 20 Gbps (TypeC), and WiFI-E6 with DBS/Bluetooth Low Energy 5.2 integrated into them.

AMD explains that the X670E chipset is designed for "unrivaled capability and extreme overclocking."  It is designed to be able to supply PCI Express Gen 5 "everywhere." A X670 is designed for "Enthusiast Overclocking," and it features support for Gen5 storage as well as graphics that are optional. Only the PCIe Gen5 storage standard will be supported by the mainstream platform that is based on the B650 chipset.

AMD also aims for higher storage speeds with their "Smart Access Storage". Smart Access Storage has the ability to shorten game loading times. Smart Access Storage should enhance the cooperation between CPU, GPU, and storage, allowing for decompression on the GPU, for example. The extracted textures are thus stored in the vram rather than the CPU's working memory, after which they must travel over the tight PCIe bus in an unpacked and hence bigger condition. In March, Microsoft included quick Xbox loading to Windows 10 and Windows 11. This SDK transports game objects directly from storage to the GPU, significantly lowering loading times.

Lastly, the Ryzen Mendocino mobile CPUs are a new series of processors for consumer notebooks designed to have a long battery life. The first of these components will be integrated into mainstream notebooks, which will be made available in the fourth quarter of 2022. These SoCs combine a 4-core/8-thread CPU based on the more established "Zen 2" microarchitecture with an integrated graphics processing unit (GPU) based on the more recent RDNA2 graphics architecture, in addition to the remainder of its I/O and power-optimization capabilities from the Ryzen 6000 series. AMD uses TSMC's N6 (6 nm) silicon production technology. The capabilities that are included in AMD Mendocino collaborate to give a battery life of 10 hours or more to mainstream notebooks. Prices for notebooks that are based on these CPUs will range from $399 to $699.