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AMD at CES 2026

AMD at CES 2026

Enterprise & IT Jan 6,2026 0

AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detailed in the show’s opening keynote how the company’s extensive portfolio of AI products and deep cross-industry collaborations are turning the promise of AI into real-world impact.

The keynote showcased major advancements from the data center to the edge, with partners including OpenAI, Luma AI, Liquid AI, World Labs, Blue Origin, Generative Bionics, AstraZeneca, Absci and Illumina detailing how they are using AMD technology to power AI breakthroughs.

“At CES, our partners joined us to show what’s possible when the industry comes together to bring AI everywhere, for everyone,” said Dr. Lisa Su, chair and CEO of AMD. “As AI adoption accelerates, we are entering the era of yotta-scale computing, driven by unprecedented growth in both training and inference. AMD is building the compute foundation for this next phase of AI through end-to-end technology leadership, open platforms, and deep co-innovation with partners across the ecosystem.”

The blueprint for yotta-scale compute
Compute infrastructure is the foundation of AI, and accelerating adoption is driving an unprecedented expansion from today’s 100 zettaflops of global compute capacity to a projected 10+ yottaflops in the next five years. Building AI infrastructure at yotta-scale will require more than raw performance; it demands an open, modular rack design that can evolve across product generations, combining leadership compute engines with high-speed networking to connect thousands of accelerators into a single, unified system.

The AMD “Helios” rack-scale platform is the blueprint for yotta-scale infrastructure, delivering up to 3 AI exaflops of performance in a single rack. It’s designed to deliver maximum bandwidth and energy efficiency for trillion-parameter training. “Helios” is powered by AMD Instinct™ MI455X accelerators, AMD EPYC™ “Venice” CPUs and AMD Pensando™ “Vulcano” NICs for scale-out networking, all unified through the open AMD ROCm™ software ecosystem.

At CES, AMD provided an early look at “Helios” and, for the first time unveiled the full AMD Instinct MI400 Series accelerator product portfolio while previewing the next-generation MI500 Series GPUs.

The latest addition to the MI400 Series is the AMD Instinct MI440X GPU, designed for on-premises enterprise AI deployments. The MI440X will power scalable training, fine-tuning and inference workloads in a compact, eight-GPU form factor that integrates seamlessly into existing infrastructure.

The MI440X builds on the recently announced AMD Instinct MI430X GPUs, which are designed to deliver leadership performance and hybrid computing for high-precision scientific, HPC and sovereign AI workloads. MI430X GPUs will power AI factory supercomputers around the world, including Discovery at Oak Ridge National Laboratory and the Alice Recoque system, France’s first exascale supercomputer.

AMD shared additional details at CES on the next-generation AMD Instinct MI500 GPUs, planned to launch in 2027. The MI500 Series is on track to deliver up to a 1,000x increase in AI performance compared to the AMD Instinct MI300X GPUs introduced in 20231. Built on next-generation AMD CDNA™ 6 architecture, advanced 2nm process technology and cutting-edge HBM4E memory, MI500 GPUs will deliver leadership at every level.

Enabling AI PC experiences everywhere
AI is becoming a foundational part of the PC experience, where billions of users will interact directly with AI, both locally on the device and through the cloud. At CES, AMD introduced new products that expand AMD’s AI PC portfolio and deepen developer support across the ecosystem.

The next-generation AMD Ryzen™ AI 400 Series and Ryzen AI PRO 400 Series platforms deliver a 60 TOPS NPU2, cutting-edge efficiency and full AMD ROCm platform support for seamless cloud-to-client AI scaling. First systems ship in January 2026, with broader OEM availability in Q1 2026.

AMD also expanded its breakthrough on-device AI compute offerings with Ryzen AI Max+ 392 and Ryzen AI Max+ 388 which supports models of up to 128-billion-parameters with 128GB unified memory. These platforms enable advanced local inference, content creation workflows and incredible gaming experiences in premium thin-and-light notebooks and small form factor (SFF) desktops.

For developers, the Ryzen AI Halo Developer Platform brings powerful AI development capabilities to a compact SFF desktop PC, delivering leadership tokens-per-second-per-dollar with high-performance Ryzen AI Max+ Series processors. Ryzen AI Halo is expected to be available in Q2 2026.

AI transforming the physical world
AMD introduced the Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power AI-driven applications at the edge. From automotive digital cockpits and smart healthcare to physical AI for autonomous systems, including humanoid robotics, the new P100 and X100 Series processors deliver high performance, efficient AI compute for the most constrained embedded systems.

Advancing the Genesis Mission and the future of AI innovation
Lisa Su was joined on stage by Michael Kratsios, Director of the White House Office of Science and Technology Policy, to discuss the role AMD has in the U.S. government’s Genesis Mission. This ambitious public/private technology initiative aims to secure U.S. leadership in AI technologies and shape scientific discovery and global competitiveness for years to come. Genesis includes two recently announced AMD-powered AI supercomputers at Oak Ridge National Laboratory, Lux and Discovery.

Mr. Kratsios also highlighted the White House’s efforts to rally organizations to pledge resources toward expanding access to AI education with more hands-on opportunities for students to learn and build. In joining the pledge, AMD announced its commitment of $150 million to bring AI into more classrooms and communities.

The keynote concluded with recognition of the more than 15,000 student innovators who participated in the AMD AI Robotics Hackathon in partnership with Hack Club.

 

AMD (NASDAQ: AMD) introduced the AMD Ryzen™ AI Embedded processors, a new portfolio of embedded x86 processors designed to power AI-driven applications at the edge. From automotive digital cockpits and smart healthcare to physical AI for autonomous systems, including humanoid robotics, the new P100 and X100 Series processors provide OEMs, tier-1 suppliers and system and software developers in automotive and industrial markets with high performance, efficient AI compute in a compact BGA (ball grid array) package for the most constrained embedded systems.

The processors integrate the high-performance “Zen 5” core architecture for scalable x86 performance and deterministic control, an RDNA 3.5 GPU for real-time visualization and graphics, and an XDNA 2 NPU for low-latency, low-power AI acceleration – all in a single chip. 

“As industries push for more immersive AI experiences and faster on-device intelligence, they need high performance without added system complexity,” said Salil Raje, senior vice president and general manager, AMD Embedded. “The Ryzen AI Embedded portfolio brings leadership CPU, GPU and NPU capabilities together in a single device, enabling smarter, more responsive automotive, industrial, and autonomous systems.”

The portfolio includes the P100 Series processors, targeting in-vehicle experiences and industrial automation, and the X100 Series processors featuring higher CPU core counts and AI TOPS performance for more demanding physical AI and autonomous systems.

Purpose-Built for In-Vehicle Experiences
Launching today, P100 Series processors featuring 4-6 cores are optimized for next-generation digital cockpits and HMI (human-machine interfaces), enabling real-time graphics for in-vehicle infotainment displays, AI-driven interactions, and multi-domain responsiveness. They deliver up to a 2.2X multi-thread and single-thread performance boost over the previous generation3, ensuring deterministic control in a compact 25×40 mm BGA package. With a 15–54-watt operating range and support for –40°C to +105°C environments, it is built for harsh, power- and space-constrained edge systems and 10-year lifecycles.

Immersive Graphics and On-Device AI Acceleration
The P100 Series processors integrate an RDNA 3.5 GPU, delivering an estimated 35% faster rendering1 to power up to four 4K (or two 8K) digital displays simultaneously at 120 frames per second. The AMD video codec engine enables high-fidelity, low latency streaming and responsive playback without burdening the CPU.

The next generation AMD XDNA 2 NPU delivers up to 50 TOPS, for up to 3X higher AI inference performance4. XDNA 2 architecture combines understanding of voice, gestures and environmental cues using supported AI models including vision transformers, compact LLMs and CNNs.

Open, Safe Software Stack for Faster System Design
Ryzen AI Embedded processors provide a consistent development environment with a unified software stack that spans the CPU, GPU, and NPU. At the runtime layer, developers benefit from optimized CPU libraries, open-standard GPU APIs, and a native XDNA architecture AI runtime enabled through Ryzen AI Software.

The entire software stack is built on the open-source, Xen hypervisor-based virtualization framework that securely isolates multiple operating system domains. This enables Yocto or Ubuntu to power the HMI, FreeRTOS to manage real-time control, and Android or Windows to support richer applications, all running safely in parallel. With an open-source foundation, long-term OS support, and an ASIL-B capable architecture, they help customers reduce costs, simplify customization, and accelerate the path to production for automotive and industrial systems.

AMD Ryzen AI Embedded
P100 Series (4-6 cores)


    INDUSTRIAL TEMP AUTOMOTIVE GRADE
  Model # P121 P132 P121i P132i P122a P132a
CPU



“Zen 5” CPU Cores 4 6 4 6 4 6
Max Frequency(5) Up to 4.4 GHz Up to 4.5 GHz Up to 4.4 GHz Up to 4.5 GHz Up to 3.65 GHz Up to3.65 GHz
L3 Shared Cache 8 MB 8 MB 8 MB 8 MB 8 MB 8 MB
GPU



Work Group Processors 1 2 1 2 2 2
4K120/8Kp120 Displays 4 / 2 4 / 2 4 / 2 4 / 2 4 / 2 4 / 2
GPU Max Frequency(6) 2.7 GHz 2.8 GHz 2.7 GHz 2.8 GHz 2.0 GHz 2.4 GHz
NPU TOPS(2) 30 50 30 50 30 50
I/O







10GE Ports w/TSN 2 2 2 2 2 2
DDR5 (ECC) 5600 MT/s N/A
LPDDR5X (ECC) MT/s 7500 MT/s 8000 MT/s 7500 MT/s 8000 MT/s 7500 MT/s w/RAS 7500 MT/s w/RAS
USB 4.0 2x USB4 N/A
Other USB 1x USB 3.2 | 1x USB3.1 | 3x USB2 | 1x USB2 (Secure BIOS)
Power & Thermal



Nominal TDP 28 W 28 W 28 W 28 W 28 W 45 W
Nominal TDP 15-54 W 15-54 W 15-54 W 15-54 W 15-30 W 25-45 W
Junction Temperature 0 to 105oC 0 to 105oC -40 to 1050C -40 to 1050C -40 to 1050C -40 to 1050C
Package,
Reliability

Package 25 mm x 40 mm
Longevity 2.5 Years (Standard) | Up to 10 Years (Extended) AEC-Q100


Product Availability

AMD Ryzen AI Embedded P100 processors featuring 4-6 cores are sampling with early access customers. Tools and documentation are available with production shipments expected in the second quarter. P100 Series processors featuring 8-12 cores targeting industrial automation applications are expected to begin sampling in the first quarter. Sampling of X100 Series processors, which offer up to 16 cores, is expected to begin in the first half of this year.

 

AMD (NASDAQ: AMD) unveiled its latest generation of mobile and desktop processors that expand its client computing portfolio, bringing expanded AI capabilities, premium gaming performance, and commercial-ready features to more systems than ever before.

AMD introduced the new AMD Ryzen™ AI 400 Series for Copilot+ PCs, Ryzen™ AI Max+ processors for premium ultra-thin and light notebooks and small form-factor desktops. The company also announced the Ryzen™ AI PRO 400 Series, enabling AI acceleration, modern security, and enterprise-class manageability designed to meet the needs of today’s business laptops.

As AI becomes central to the PC experience, AMD is expanding its hardware portfolio with the launch of AMD Ryzen™ AI Halo—the company’s first AMD-branded AI developer platform. Hardware is only the beginning: AMD also announced new ROCm™ 7.2 software support for all Ryzen™ AI 400 Series processors, along with a new AI bundle feature for AMD Software: Adrenalin™ Edition, making AI adoption, development, and deployment seamless and accessible.

For gamers, AMD is announcing a successor to the best gaming CPU on the market. The Ryzen™ 7 9850X3D builds on the legacy of the Ryzen™ 7 9800X3D with a 400MHz higher boost clock, delivering new levels of gaming performance and usurping the gaming crown. For Radeon™ users, FSR “Redstone” brings ML frame generation and upscaling to the latest AAA titles, advancing AMD’s vision of a full-stack AI computing platform.

“The PC is being redefined by AI, and AMD is leading that transformation,” said Jack Huynh, senior vice president and general manager, AMD Computing and Graphics Group. “Across consumer, commercial, and enthusiast systems, we’re delivering platforms that bring high-performance computing, leadership AI, immersive graphics, and a growing software ecosystem that empowers developers and creators, so intelligence is built in, performance and efficiency scale seamlessly, and innovation extends to every form factor. Our full-stack approach is coming to life, enabling smarter, faster, and more immersive experiences for users, today and tomorrow.”

Introducing the AMD Ryzen AI 400 Series and AMD Ryzen AI PRO 400 Series
AMD is delivering next-generation AI experiences across both consumer and commercial Copilot+ PCs, the fastest, most intelligent and secure Windows PCs ever, with the new Ryzen AI 400 Series and Ryzen AI PRO 400 Series processors. Built on the advanced “Zen 5” architecture and powered by second-generation AMD XDNA™ 2 NPUs, both processor families deliver up to 60 TOPS of NPU AI compute1, with every processor in the stack exceeding Copilot+ PC requirements for seamless AI experiences. With up to 12 high-performance CPU cores, integrated AMD Radeon 800M Series graphics, and faster memory speeds, these processors unlock leadership performance, multi-day battery life, and intelligent compute across a wide range of systems and form factors.2

For enterprise users, the Ryzen AI PRO 400 Series is purpose-built for modern IT environments, delivering advanced performance alongside AMD PRO Technologies for multilayered security, streamlined manageability, and long-term platform stability. Designed to help IT teams modernize fleets with confidence, these processors offer enterprise-grade reliability while supporting the same AI features available across the broader Ryzen AI 400 Series. This ensures enterprise users have a consistent and premium user experience while ITDMs benefit from unmatched performance and value.

With this latest generation of Ryzen™ AI processors, AMD is leading the evolution of AI PCs from early adoption to mainstream utility, advancing the category with more compute, broader platform reach, and richer on-device experiences. Together with ecosystem partners, Ryzen AI 400 Series processors power the next wave of truly responsive, intelligent computing.

Pricing and Availability
Systems powered by AMD Ryzen AI 400 Series and AMD Ryzen AI PRO 400 Series processors will be available beginning Q1 2026 from major OEMs including Acer, ASUS, Dell, HP, GIGABYTE, and Lenovo. Desktops featuring the Ryzen AI 400 Series will be introduced later in Q2 2026.

Model Cores / Threads Boost3 /
Base
Frequency
Total Cache Graphics
Model
cTDP NPU TOPS1 Graphics CUs
AMD Ryzen™ AI 9 HX 475 12 C / 24 T Up to 5.2 /
2.0 GHz
36 MB AMD Radeon™
890M Graphics
15-54W 60 16
AMD Ryzen™ AI 9 HX 470 12 C / 24 T Up to 5.2 /
2.0 GHz
36 MB AMD Radeon™
890M Graphics
15-54W 55 16
AMD Ryzen™ AI 9 465 10 C / 20 T Up to 5.0 /
2.0 GHz
34 MB AMD Radeon™
880M Graphics
15-54W 50 12
AMD Ryzen™ AI 7 450 8 C / 16 T Up to 5.1 /
2.0 GHz
24 MB AMD Radeon™
860M Graphics
15-54W 50 8
AMD Ryzen™ AI 7 445 6 C / 12 T Up to 4.6 /
2.0 GHz
14 MB AMD Radeon™
840M Graphics
15-54W 50 4
AMD Ryzen™ AI 5 435 6 C / 12 T Up to 4.5 /
2.0 GHz
14 MB AMD Radeon™
840M Graphics
15-54W 50 4
AMD Ryzen™ AI 5 430 4 C / 8 T Up to 4.5 /
2.0 GHz
12 MB AMD Radeon™
840M Graphics
15-54W 50 4
AMD Ryzen™ AI 9 HX PRO 475 12 C / 24 T Up to 5.2 /
2.0 GHz
36 MB AMD Radeon™
890M Graphics
15-54W 60 16
AMD Ryzen™ AI 9 HX PRO 470 12 C / 24 T Up to 5.2 /
2.0 GHz
36 MB AMD Radeon™
890M Graphics
15-54W 55 16
AMD Ryzen™ AI 9 PRO 465 10 C / 20 T Up to 5.0 /
2.0 GHz
34 MB AMD Radeon™
880M Graphics
15-54W 50 12
AMD Ryzen™ AI 7 PRO 450 8 C / 16 T Up to 5.1 /
2.0 GHz
24 MB AMD Radeon™
860M Graphics
15-54W 50 8
AMD Ryzen™ AI 5 PRO 440 6 C / 12 T Up to 4.8 /
2.0 GHz
22 MB AMD Radeon™
840M Graphics
15-54W 50 4
AMD Ryzen™ AI 5 PRO 435 6 C / 12 T Up to 4.5 /
2.0 GHz
14 MB AMD Radeon™
840M Graphics
15-54W 50 4


AMD Expands the AMD Ryzen AI Max+ Series Portfolio

AMD announced the Ryzen™ AI Max+ 392 and Ryzen™ AI Max+ 388, new additions to the Ryzen™ AI Max+ Series that extend high-performance AI compute, integrated desktop-class graphics, and unified memory architecture to premium ultra-thin laptops, workstations, and compact mini-PCs. The Ryzen AI Max+ processors build on strong early adoption and enable OEMs to deliver Copilot+ PCs optimized for both demanding creative and AI workloads, and immersive gameplay, without compromising portability or user experience.

The latest Ryzen AI Max+ Series processors combine high-efficiency AMD “Zen 5” cores with AMD Radeon™ 8060S Series graphics and second-generation AMD XDNA™ architecture-based NPUs to deliver exceptional performance in a single, power-efficient architecture. Whether accelerating large language models, rendering high-resolution media, or playing modern games at high settings, Ryzen AI Max+ Series processors are engineered to deliver versatile, uncompromised performance in premium ultra-thin designs.

Pricing and Availability
Systems powered by new AMD Ryzen AI Max+ Series processors will be available beginning Q1 2026 from major OEM partners including Acer and ASUS, with more systems expected throughout the year.

Model Cores / Threads Boost3 /
Base
Frequency
Total Cache Graphics
Model
cTDP NPU TOPS1 Graphics CUs
AMD Ryzen™
AI Max+ 392
12 C / 24 T Up to 5.0 /
3.2 GHz
76 MB AMD Radeon™
8060S Graphics
45-120W 50 40
AMD Ryzen™ 
AI Max+ 388
8 C / 16 T Up to 5.0 /
3.6 GHz
40 MB AMD Radeon™
8060S Graphics
45-120W 50 40


AMD Ryzen AI Halo Reimagines the Ultimate AI & Workstation PC

AMD also unveiled the AMD Ryzen™ AI Halo developer platform, a new AMD-branded mini-PC designed to advance AI development. Built with the high-performance Ryzen AI Max+ Series processors, the new developer platform delivers desktop-class AI compute and integrated graphics in a compact footprint, capable of running up to 200 billion parameter models locally.4 AMD Ryzen AI Halo features up to 128GB of unified memory, up to 60 TFLOPS of AMD RDNA™ 3.5 graphics performance, and support for both Windows and Linux. Out of the box, AMD Ryzen AI Halo is fully optimized for the latest AMD ROCm software and AI developer workflows, providing a seamless day-one experience and ensuring developers can access innovative AI applications and models pre-installed, for a frictionless experience.

Pricing and Availability
Ryzen AI Halo is planned for introduction in the second quarter of 2026. Pricing and commercial availability details will be shared closer to launch.

Next-Level Gaming Performance with Ryzen™ 9850X3D Processors
AMD is raising the bar for desktop gaming with the introduction of the Ryzen™ 7 9850X3D processor, the newest and fastest gaming processor in the Ryzen 9000X3D lineup. Built on “Zen 5” architecture and featuring second-generation AMD 3D V-Cache™ technology, this processor delivers incredible performance gains in today’s most demanding games, with up to 27% better gaming performance compared to the Intel Core Ultra 9 285K.5

With eight high-performance cores and 16 threads, the Ryzen 9850X3D processor is optimized for maximum efficiency in gaming workloads, delivering ultra-low latency and exceptional frame rates. It features a boost frequency of up to 5.6 GHz3 and 104MB of total cache, enabling smooth gameplay and multitasking across modern titles, streaming, and background applications.

With incredible cache capacity and performance optimized for gaming leadership, the 9000X3D Series continues to raise the bar for enthusiast gamers.

Pricing and Availability
Systems powered by AMD Ryzen 7 9850X3D Series processors will be available from major OEMs, and SI and retail partners beginning Q1 2026.

Model Cores / Threads Boost3 / Base
Frequency
Total Cache TDP
AMD Ryzen™ 7
9850X3D
8 C / 16 T Up to 5.6 / 4.7 GHz 104 MB 120W


OEM and Ecosystem Momentum

Across market segments, AMD continues to grow its footprint, with more systems than ever powered by AMD processors. From premium consumer and gaming laptops to high-performance systems for creators, developers, and business users, leading OEMs are choosing AMD to anchor their most important designs. This momentum reflects rising customer demand and an unmatched portfolio that delivers across performance, efficiency, and AI leadership.

In addition to expanding its OEM system lineup, AMD is accelerating momentum across the AI ecosystem by working with leading software developers to bring new AI features into the applications people use every day. From content creation and productivity to gaming, these collaborations ensure Ryzen AI PCs deliver real, tangible benefits out of the box. Backed by a growing foundation of tools, frameworks, and developer support, AMD is enabling faster workflows, smarter automation, and more personalized experiences across its platforms.

AMD Enables Next-Gen Experiences Across the Software Stack
AMD is advancing its software stack across AI, gaming, and commercial segments to deliver broader compatibility, easier access, and more performance for developers and users alike. Recent updates span Ryzen, Radeon, and Ryzen AI products, enabling tighter platform integration and improved tools for modern workloads.

AMD ROCm Software Expands Developer Access
AMD announced AMD ROCm software, the open software platform from AMD, now supports Ryzen AI 400 Series processors and is available as an integrated download through ComfyUI. The upcoming AMD ROCm software 7.2 release will extend compatibility across both Windows and Linux, and new PyTorch builds can now be easily accessed through AMD software for streamlined deployment on Windows.

Over the past year, AMD ROCm software has delivered up to five times improvement in AI performance. Platform support has doubled across Ryzen and Radeon products in 2025, and availability now spans Windows and an expanded set of Linux distributions, contributing to up to a tenfold increase in downloads year-over-year.6

Together, these updates make AMD ROCm software a more powerful and accessible foundation for AI development, reinforcing AMD as a platform of choice for developers to build the next generation of intelligent applications.

AMD Software: Adrenalin Edition Expands to Offer Seamless AI Integration
AMD is also introducing AMD Software: Adrenalin Edition AI Bundle, a new optional feature designed to simplify and accelerate local AI setup. With a single, streamlined installation, the AI Bundle equips AMD-powered systems with the essential tools needed to begin building and running AI workloads, eliminating complex configurations and reducing setup time. Users can access popular applications for image generation and local LLMs, as well as new support for PyTorch on Windows, making it easier than ever to explore AI development directly on their PC.

AMD FSR “Redstone” featuring new Machine Learning Gaming Technologies
Last month, AMD released its highly anticipated AMD FSR “Redstone” features, including FSR Upscaling and FSR Frame Generation, now available in the AMD Software: Adrenalin Edition 25.12.1 driver.

Designed to improve visual quality and performance in modern games, FSR Upscaling and FSR Frame Generation use machine learning to deliver sharper visuals and smoother frame rates for a better gameplay experience. FSR Upscaling reconstructs crisp, high-resolution images from lower-resolution frames, while FSR Frame Generation creates and inserts new frames between rendered ones, delivering smoother and higher frame rate gaming. Both features are now available through the AMD Software: Adrenalin Edition 25.12.1 driver.

In addition, AMD announced FSR Radiance Caching, which enhances ray tracing performance by intelligently predicting light behavior. This reduces render time while preserving high visual fidelity, offering greater efficiency without sacrificing quality. FSR Radiance Caching is available now as a developer preview on GPUOpen.com.

Tags: AMDCES 2026
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