Breaking News

Apple debuts iPhone 17, Pro, Max, Air, Watch Series 11, Watch Ultra 3, Watch SE 3, AirPods Pro 3 Sigma Announces 35mm F1.2 DG II, 135mm F1.4 and 20-200mm 10x Zoom Lens AMD announces Instinct MI350 Series GPUs Tamron announces 25-200mm F/2.8-5.6 Di III VXD G2 The New viaim OpenNote Makes Press Debut at IFA 2025 Showcasing Lifestyle Earbuds with AI Power for Work and Play

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

TSMC And Imagination To Optimise 16nm FinFET Design Flows

TSMC And Imagination To Optimise 16nm FinFET Design Flows

Enterprise & IT Mar 25,2013 0

TSMC and Imagination will work closely to develop highly optimised reference design flows and silicon implementations using Imagination's PowerVR Series6 GPUs combined with TSMC's process technologies, including 16-nanometer (nm) FinFET process technology. TSMC and Imagination will work closely to develop highly optimised reference design flows and silicon implementations using Imagination's PowerVR Series6 GPUs combined with TSMC's process technologies, including 16-nanometer (nm) FinFET process technology. Imagination and TSMC R&D teams also plan to work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC's 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile SoCs.

To address these challenges, Imagination and TSMC are investigating how the characteristics of the latest processes, such as 16FinFET, influence the design of high performance IP-based SoCs.

Says Hossein Yassaie, CEO of Imagination: "Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products. We are delighted to announce our strengthening relationship with TSMC, and look forward to seeing the fruits of these projects benefiting our many mutual customers."

"Just as memory drove silicon processes in the '80s and '90s, and CPUs drove processes further in the late '90s and '00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies," said Dr. Cliff Hou, TSMC Vice President, R&D. "We're pleased to be working with Imagination, an established leader in mobile and embedded GPU IP, to understand how best to use PowerVR GPUs to work with us to optimize future generations of our most advanced process technologies, and advanced system design techniques."

Graphics processors are gaining importance in mobile devices, and Apple and Nvidia are creating mobile chips that can render high-definition games and video.



Imagination's PowerVR graphics cores are used in Apple's mobile devices, Samsung's eight-core Exynos Octa 5 chip, Intel-based tablets and other products.

Neither Imagination nor TSMC said when the Series6 chips with 3D transistors would become available.

Intel was the first implement 3D transistors in CPUs when it started making chips using the 22-nanometer process in 2011. GlobalFoundries is expected to implement FinFET in its manufacturing process starting in 2014.

Tags: TSMCImagination Technologies
Previous Post
ASUS Intros Ultra-Slim SDRW-08U5S-U External DVD Writer
Next Post
Apple Buys WiFiSlam

Related Posts

  • TSMC to boost 5nm chip output in 2H21

  • TSMC Announces 7nm Automotive Design Enablement Platform

  • Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes

  • TSMC Does Not Accept New Orders From Huawei: Nikkei

  • TSMC to Build Arizona Chip Plant

  • Trump In Talks With Chip Makers Including TSMC to Bring Factories in the US: report

  • TSMC Expected to Enjoy Significant Growth in 2020 on Demand for Advanced Chips

  • Chinese BAIC Capital Get Access to Imagination Technologies' GPU IP Through Automotive Joint Venture

Latest News

Apple debuts iPhone 17, Pro, Max, Air, Watch Series 11, Watch Ultra 3, Watch SE 3, AirPods Pro 3
Smartphones

Apple debuts iPhone 17, Pro, Max, Air, Watch Series 11, Watch Ultra 3, Watch SE 3, AirPods Pro 3

Sigma Announces 35mm F1.2 DG II, 135mm F1.4 and 20-200mm 10x Zoom Lens
Cameras

Sigma Announces 35mm F1.2 DG II, 135mm F1.4 and 20-200mm 10x Zoom Lens

AMD announces Instinct MI350 Series GPUs
GPUs

AMD announces Instinct MI350 Series GPUs

Tamron announces 25-200mm F/2.8-5.6 Di III VXD G2
Cameras

Tamron announces 25-200mm F/2.8-5.6 Di III VXD G2

The New viaim OpenNote Makes Press Debut at IFA 2025 Showcasing Lifestyle Earbuds with AI Power for Work and Play
Consumer Electronics

The New viaim OpenNote Makes Press Debut at IFA 2025 Showcasing Lifestyle Earbuds with AI Power for Work and Play

Popular Reviews

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Terramaster F8-SSD

Terramaster F8-SSD

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Pure Base 501

be quiet! Pure Base 501

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed