TSMC's shipments of 28-nanometer process technology reached 24% of total wafer revenues. 40/45-nanometer accounted for 23% of total wafer revenues. Advanced technologies, defined as 40/45-nanometers and below, accounted for 47% of total wafer revenues.
"Thanks to strong demand from mobile-related applications, our 28-nanometer strength, and favorable currency exchange rate, our first quarter revenue exceeded the guidance given three months ago," said Lora Ho, SVP and Chief Financial Officer of TSMC. "We expect the strong mobile demand, especially in emerging markets, to continue in the second quarter," Ho indicated.
TSMC said it expects revenue to grow to between NT$154-156 billion in the second quarter. Gross profit margin is expected to be between 47.5% and 49.5%, while operating profit margin is expected to be between 35% and 37%, the company said.
In order to prepare for a fast ramp up of 20-nanometer starting next year, TSMC further raised the capital expenditure estimate for 2013 to be in the range between US$9.5 billion and US$10 billion.
Chairman and CEO Morris Chang said trial production using the 20 nanometer technology began in the first quarter, while the company plans to advance further with 16 nanometer technology in a year from now. The 16nm FinFET node will be ready for risk production by the year-end, Chang said.