Developed for LED printer printheads, the Epi Film Bonding technology enables thin films to be released and bonded to dissimilar materials. The OKI Group is the world's first company to achieve high-volume production of LED printheads based on this technology, which enables higher density semiconductors and multi-layers, contributing to low power consumption devices. The OKI Group believes that this technology will open doors to the development of various innovative compound circuit ICs.
Featuring the world?s first 65-micrometer pitch between LED chips, OKI's new LED display also realizes high density to deliver high-definition images while maintaining diminutive dimensions. Since it is self-illuminating, the new display features faster response, more compact dimensions, and lower power consumption than LCD displays that require a separate light source. It also features high contrast (over 5000:1) for high visibility even in bright daylight.
OKI Digital Imaging will manufacture the LED display at the newly-acquired LED manufacturing facility in Gunma prefecture, Japan. Shipments of samples are expected to begin by the end of fiscal year 2010.
"The new technology has made it possible for us to develop a groundbreaking LED display that provides high definition images while maintaining compact dimensions," said Hiroshi Kikuchi, President of OKI Digital Imaging. "The development of the world?s first thin-film-bonding technology in 2006 marked a significant milestone for the OKI Group. As shown by today?s announcement, that technology laid the foundations for continuing developments in LEDs. The OKI Group plans to leverage the expertise and technical knowledge accumulated over 20 years of experience with LED printing to develop new technologies in other areas and to expand its LED-related businesses."