Based on the Intel Many Integrated Core (Intel MIC) architecture, Intel Xeon Phi coprocessors will complement the existing Intel Xeon processor E5-2600/4600 product families to power highly parallel applications. With Intel Xeon Phi products handling much of the "highly parallel" processing to help supercomputers produce answers for a wide range of scientific and technical disciplines such as genetic research, oil and gas exploration and climate modeling, Intel believes that this powerful combination will help blaze a path to Exascale computing, which would mark a thousand-fold increase in computational capabilities over Petascale.
The Intel Xeon Phi coprocessor takes advantage of familiar programming languages, parallelism models, techniques and developer tools available for the Intel architecture. This helps ensure that software companies and IT departments are equipped with greater use of parallel code without retraining developers on proprietary and hardware specific programming models associated with accelerators. Intel is providing the software tools to help scientists and engineers optimize their code to take full advantage of Intel Xeon Phi coprocessors, including Intel Parallel Studio XE and Intel Cluster Studio XE. Available today, these tools enable code optimization and, through using the same programming languages and models shared by Intel Xeon Phi coprocessors and Intel Xeon processors E5 product family, help applications benefit both from tens of Intel Xeon Phi coprocessor cores and also from more efficient use of Intel Xeon processor threads.
Built with Intel's most advanced 22-nanometer, 3-D tri-gate transistors, Intel is introducing two new Intel Xeon Phi coprocessor families.
The Intel Xeon Phi coprocessor 3100 family will provide value for those seeking to run compute-bound workloads such as life science applications and financial simulations. The Intel Xeon Phi 3100 family will offer more than 1000 Gigaflops (1 TFlops) double-precision performance, support for up to 6GB memory at 240GB/sec bandwidth, and a series of reliability features including memory error correction codes (ECC). The family will operate within a 300W thermal design point (TDP) envelope.
The Intel Xeon Phi coprocessor 5110P provides additional performance at a lower power envelope. It reaches 1,011 Gigaflops (1.01 TFlops) double-precision performance, and supports 8GB of GDDR5 memory at a higher 320 GB/sec memory bandwidth. With 225 watts TDP, the passively cooled Intel Xeon Phi coprocessor 5110P delivers power efficiency that is ideal for dense computing environments, and is aimed at capacity-bound workloads such as digital content creation and energy research.
To provide early access to new Intel Xeon Phi coprocessor technology, Intel has additionally offered customized products: Intel Xeon Phi coprocessor SE10X and Intel Xeon Phi coprocessor SE10P.These offer 1073 GFlops double precision performance at a 300W TDP with rest of the specification similar to Intel Xeon Phi coprocessor 5110P.
The Intel Xeon Phi coprocessor 5110P is shipping today with general availability on Jan. 28 with recommended customer price of $2,649. The Intel Xeon Phi coprocessor 3100 product family will be available during the first half of 2013 with recommended customer price below $2,000.