Apple's latest iPhone 6 devices use chips from Qualcomm, Skyworks Solutions, Avago Technologies according to iFixit, which took Apple's devices apart. Starting with the iPhone 6, it is based on the Apple A8 APL1011 SoC + SK Hynix RAM (possibly 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus). However, Apple in the past has depended on multiple companies to supply its memory chips. The iPhone 6 also uses a Qualcomm MDM9625M LTE Modem.

iFixit technicians also discovered a Murata 339S0228 Wi-Fi Module, a Broadcom BCM5976 touchscreen controller, and chips from Skyworks ( Skyworks 77802-23 Low Band LTE PAD, SkyWorks 77803-20, SkyWorks 77356-8 Mid Band PAD), Avago (Avago A8020 High Band PAD, Avago A8010 Ultra High Band PA + FBARs) and TriQuint. The iPhone 6 also uses 128 Gb (16 GB) NAND Flash by SanDisk and includes NFC radio chips used for the new Apple Pay mobile payment platform. The NFC chip in the iPhone 6 Plus comes from NXP Semiconductors. NXP also supplies a motion co-processor, key to making the iPhone's sensors work without draining its battery.

The larger iPhone 6 Plus also uses an Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM, the same Qualcomm LTE modem and Avago chips, SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash, a Murata 339S0228 Wi-Fi Module and the same Broadcom BCM5976 touchscreen controller. NXP's chips are also present as a motion coprocessor (M8) and the secure element.

iFixit also found a new rubber gasket surrounding the volume and power buttons, which seem designed to protect the buttons from water and dust better than on older models.

The 6 Plus contains a larger screen that the iPhone 6, a 2,915 mAH battery -- almost twice that of the 5S and larger than the 6's 1,810 mAH power pack -- and an optical image stabilisation for the 8-megapixel camera.

As well as Apple's stores, AT& , Sprint , T-Mobile US and Verizon Wireless in the United States will start selling the phones on Friday.