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Toshiba XG6 1TB SSD review

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1. Toshiba XG6 1TB SSD - 96-layer 3D NAND for OEMs

 

 

Toshiba ha srecently come up with the first SSD with 96-layer 3D NAND, the XG6. Moving from the 64-layer 3D NAND to the 96-layer 3D NAND allows for better performance, improved power efficiency, and lower costs.

Released for OEMs, the XG series is not officially available for retail purchase. The series is optimized for power-sensitive mobile PCs, performance-oriented gaming PCs, as well as data center environments for server-boot, caching and logging.

But it is the most advanced flash memory currently shipping. The increased layer count improves density but the TLC die capacities are still 256Gb and 512Gb. The I/O interface has been upgraded to the Toggle NAND 3.0 standard, with speeds in the 667-800MT/s range compared to the 400-533MT/s speeds used by earlier 3D NAND from Toshiba. The NAND interface voltage has also dropped from 1.8V to 1.2V, so the higher I/O speed shouldn't have much impact on power efficiency.

With 4th generation BiCS FLASH and SLC cache features, XG6 SSDs reach up to sequential read/write speeds of 3180 MB/s and 2960 MB/s respectively and deliver up to 355,000 random read and 365,000 random write IOPS. In addition to high performance, XG6 carries on the low power design of the XG family, consuming 4.7 W or less in active mode and less than 3 mW in stand-by mode.

Available in a compact M.2 2280 single-sided form factor, the XG6 series comes in three capacity models of 256 GB, 512 GB and 1024 GB, each with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.

  M.2 2280-S2 (Single-sided)
Basic Specifications
Model Number (Non-SED) KXG60ZNV1T02 KXG60ZNV512G KXG60ZNV256G
(SED) KXG6AZNV1T02 KXG6AZNV512G KXG6AZNV256G
Fomatted Capacity 1,024 GB 512 GB 256 GB
Connector Type M.2 M
Interface PCI Express Base Specification Revision 3.1a (NVM Express Revision 1.3a command set)
Maximum Interface Speed 32 GT/s (PCIe Gen3X4)
Memory Type TLC (BiCS Flash)
Sequential Read (Up to) 3,180 MB/s 3,100 MB/s 3,050 MB/s
Sequential Write (Up to) 2,960 MB/s 2,800 MB/s 1,550 MB/s
Reliability
MTTF 1,500,000 hours
Power Requirements
Supply Voltage 3.3 V ±5 %
Power consumption (Active) 4.7 W typ. 4.1 W typ. 4.0 W typ.
Power Consumption (L1.2 mode) 3 mW typ.
Dimensions
Height 2.23 mm
Width 22.0 mm
Length 80.0 mm
Weight 7.3 g typ. 7.0 g typ.
Environmental
Temperature (Operating) 0 to 95 °C (Controller Temperature)
0 to 85 °C ( Other Components Temperature )
Temperature
(Non-operating)		 -40 to 85 °C
Vibration
(Operating/Non-operating)		 196 m/s2 { 20 G } ( Peak, 10 to 2,000 Hz )
Shock
(Operating/Non-operating)		 14.7 km/s2 { 1,500 G } ( 0.5 ms )
More features
  • Sanitize is supported.
  • Namespace Management and Namespace Attachment commands are supported.
  • Non-Operational Power State Configuration is supported.
  • TCG Storage Interface Interactions Specification (SIIS) Version 1.07 is supported.

The XG6 came with a rigid plastic label that gives it the polished appearance of a retail product:

The Toshiba XG6 isusing the same TC58NCP090GSB 8-channel controller as the previous XG5 series, but has a newly developed firmware.

The 1TB version of the XG6 SSD we have in our hands has a single-sided design to maximize compatibility with the thinnest notebook computers. It packs two NAND packages each containing eight 512Gb BiCS4 3D TLC dies.

The 1TB XG6 SSD came with firmware AGXA4001 installed. Each of the two 96-layer BiCS4 NAND Flash chips offer 512GB of raw storage space and after being formatted in a Windows enthronement you are looking at 953GB of reported free space:

 

 

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