SK hynix Inc. launched a new low-power Non-Volatile Memory express (NVMe) Enterprise SSD (eSSD) with the 72-layer TLC 3D NAND flash that offers great performance for power as well as Quality of Service.

The product features an in-house NVMe controller on top of the 72-layer 3D NAND technology currently in mass production.

SK hynix is a memory producer that designs, develops, and mass-produces all key components, from NAND and DRAM to controllers, in-house, for not only Client but now also Enterprise applications.

The new NVMe SSD targets the mainstream eSSD market with optimum performance, power and cost. With an eight-channel NAND interface, the drive provides the maximum density of up to 4TB in the M.2 form factor and 8TB in U.2., and delivers sequential read of up to 3.2GB/s and random write of 160K IOPS at 14W or below. Compared to the eSSD with 72-layer 256Gb 3D NAND, announced by Sk hynix at the August 2018 Flash Memory Summit (FMS) and qualified with major datacenter companies, the new SSD improves sequential read by 30% and random write by up to 70% at the equal capacity and form factor. It supports both read-intensive and mixed-use applications, such as internet data centers, AI, ML, or Virtual Desktop Infrastructure (VDI).

With this product, SK hynix seeks to secure a leading edge in the eSSD market as it transitions from Serial Advanced Technology Attachment (SATA) to NVMe. The new SSD began its qualification with top-tier global cloud service providers and server makers, with volume production slated to begin in the second half of 2019. The S. Korean company also plans to launch a 16TB eSSD based on 96-layer 4D NAND at the end of this year, with mass production starting next year.

According to market researcher Forward Insights, NVMe SSDs are expected to make up more than half of the Enterprise SSD market in 2019, with the NVMe interface accounting for 90% or more of total SSD gigabytes by 2023.