Broadcom today announced the BCM43752 chip, which extends the benefits of Wi-Fi 6 to the broader smartphone market.
The BCM43752 is an integrated chip that brings together the latest Wi-Fi 6 and Bluetooth 5 innovations to offer smartphone makers a low-cost solution for their mass market products.
The chip supports OFDMA and MU-MIMO technologies for better performance in crowded environments, roaming capabilities supporting multi-band operation (MBO), and WPA3 security protocols.
The BCM43752 also reduces smartphone bill of materials by integrating RF components such as power amplifiers (PAs) and low-noise amplifiers (LNAs) into the device. In addition, it is engineered to support “chip-on-board” designs providing further cost reduction opportunities for manufacturers. Different packaging options for the chip also create flexibility for phone designers to balance space constraints, cost and radio performance.
Key features include:
- Support for two-stream Wi-Fi 6
- Bluetooth 5 features including Low-Energy 2 Mbps (LE2) and Low-Energy Long Range (LE LR)
- FM radio receiver
- 1.2 Gbps Wi-Fi PHY Rate
- Wi-Fi 6 features including 1024-QAM Modulation, OFDMA, MU-MIMO, MBO and WPA3
- Concurrent Access Point - Station (AP-STA) function
- Dual-band integrated PAs and LNAs for reduced cost
- Module or chip-on-board packaging options for design flexibility
- Support for PCIe 2.0 and SDIO 3.0 interfaces for Wi-Fi
The BCM43752 is available now for mass production.