BeQuiet Jubiläum Banner 970x90
Breaking News

Xbox & Bethesda Developer_Direct Showcases Games Coming to Xbox, PC and Game Pass Samsung announces Odyssey Neo G7 43″ First Mini-LED Flat Gaming Monitor SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T MSI Kicks Off New Partnership with Mercedes-AMG Team Craft-Bamboo Racing Pioneer Japan releases new BDR-WX01DM external BD/DVD/CD writer for JIS X6257 standard and 100-year lifespan BD-R disc

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

TSMC To Move To 10nm Production in 2016

TSMC To Move To 10nm Production in 2016

Enterprise & IT May 28,2015 0

Following Samsung's recent announcement that it would move to 10nm FinFET process next year, TSMC remains confident that it would will beat its South Korean "rival" in the foundry business by ramping up production on its 10nm lines. TSMC plans to start mass production of chips using its 10nm FinFET process by the end of 2016 - about the same time as Samsung - according to president and co-CEO CC Wei. The advanced process will be in risk production later in 2015.

The Taiwanese company will hold its Taiwan Technology Symposium 2015 on May 28, where the foundry is expected to talk about the progress and development of its FinFET manufacturing nodes.

TSMC's main competitor in the chip making process is Intel, which might release its first chips made using 10nm process technology as early as in the middle of 2016.

Until then, TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a low-power version of the 16FF+ process in early 2016. The 16FF+ process is targeted at high-performance chip solutions, and the lower-power 16FF+ process dubbed 16FFC will be for price-sensitive mobile devices, and wearable and IoT applications.

Total production capacity of the foundry's 16nm FinFET processes at the end of 2016 will triple that a year earlier, said Wei.

According to Digitimes.com, TSMC's 16FF+ process has received more than 20 product tape-outs, 10 of which have achieved satisfying yield performance. By the end of 2015, the number of the tape-outs will top 50 covering different chip products, Wei said.

Challenges ahead

Despite the bold announcements by all the world's largest foundries, the road to further shrinking transistors is long, and still there are challenges to overcome.

Employing EUV lithography technology has proven prohibitively difficult for years, and manufacturers have had to repeatedly push back their commercialization targets. As an alternative, chipmakers came up with ways to create 3-D transistors and multiple-layered chips to enhance overall performance.

Eidec, a Japanese research consortium, claims it has achieved a breakthrough in chipmaking technology that could boost semiconductor performance while significantly reducing production time.

The consortium has developed a highly sensitive resist for extreme ultraviolet lithography equipment at its laboratory in Tsukuba, Ibaraki Prefecture.

In chipmaking, the shorter the light source's wavelength, the more finely a circuit's lines can be etched. Currently, argon fluoride (ArF) lasers, which have a wavelength of 193 nanometers, are used to mass-produce the most advanced chips, those with lines 14-15 nanometers wide. To efficiently manufacture chips with circuit lines finer than 10 nanometers, the practical application of EUV lithography is essential. The stumbling block has been finding a resist suitable for the process. Eidec's researchers claim that their new resist should help boost the productivity of lithography exposure significantly.

In experiments, Eidec was able to use EUV lithography to rapidly create circuit patterns with 17-nanometer-wide lines.

Advances have also been made in light-source output technology for EUV lithography, another aspect affecting productivity. ASML, the largest maker of semiconductor lithography equipment, has succeeded in raising the light-source exposure from 10-20 watts to about 80 watts.

Members of the consortium -- Fujifilm, JSR and Tokyo Ohka Kogyo -- plan to provide the new resist to semiconductor makers globally. These chipmakers are looking to use EUV lithography to mass-produce 10-nanometer-class chips by 2017 and 7-nanometer-class chips by 2019.

Tags: TSMC
Previous Post
Avago to Acquire Broadcom for $37 Billion
Next Post
Sony to Acquire Optical Archive As It Enters The Data Center Storage Market

Related Posts

  • TSMC to boost 5nm chip output in 2H21

  • TSMC Announces 7nm Automotive Design Enablement Platform

  • Synopsys and TSMC Collaborate to Enable Designs of HPC, Mobile, 5G, and AI SoCs with Certified Solutions on TSMC N5 and N6 Processes

  • TSMC Does Not Accept New Orders From Huawei: Nikkei

  • TSMC to Build Arizona Chip Plant

  • Trump In Talks With Chip Makers Including TSMC to Bring Factories in the US: report

  • TSMC Expected to Enjoy Significant Growth in 2020 on Demand for Advanced Chips

  • TSMC Reports High First Quarter Profit on iPhone Demand

BeQuiet Jubiläum Banner 300x600

 

Latest News

Xbox & Bethesda Developer_Direct Showcases Games Coming to Xbox, PC and Game Pass
Gaming

Xbox & Bethesda Developer_Direct Showcases Games Coming to Xbox, PC and Game Pass

Samsung announces Odyssey Neo G7 43″ First Mini-LED Flat Gaming Monitor
Gaming

Samsung announces Odyssey Neo G7 43″ First Mini-LED Flat Gaming Monitor

SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T
Enterprise & IT

SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T

MSI Kicks Off New Partnership with Mercedes-AMG Team Craft-Bamboo Racing
Gaming

MSI Kicks Off New Partnership with Mercedes-AMG Team Craft-Bamboo Racing

Pioneer Japan releases new BDR-WX01DM external BD/DVD/CD writer for JIS X6257 standard and 100-year lifespan BD-R disc
Optical Storage

Pioneer Japan releases new BDR-WX01DM external BD/DVD/CD writer for JIS X6257 standard and 100-year lifespan BD-R disc

Popular Reviews

Withings Thermo Wi-Fi-connected temporal thermometer

Withings Thermo Wi-Fi-connected temporal thermometer

EnGenius ECW230 Access Point

EnGenius ECW230 Access Point

Withings Body Plus Scale

Withings Body Plus Scale

Withings Sleep Analyzer

Withings Sleep Analyzer

Noctua NH-D12L CPU Cooler

Noctua NH-D12L CPU Cooler

EnGenius ECW230S AP

EnGenius ECW230S AP

Scythe Fuma 2 CPU Cooler

Scythe Fuma 2 CPU Cooler

be quiet! Pure Rock 2 FX

be quiet! Pure Rock 2 FX

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed