In the leading edge system LSI business, process technologies are shrinking to achieve high-speed, low-power system LSI for application in digital consumer products and mobile communication equipment, and products with 90nm technologies are entering volume production. To achieve further improvements in performance and power consumption, 65nm and even 45nm process technologies are now being developed. Achievement of 45nm system LSI will demand more development resources than ever, and system LSI companies worldwide are promoting collaboration to achieve more efficient development.
In this environment, Toshiba and NEC Electronics will integrate process technologies they have heretofore developed individually, and share newly-developed technologies.
The companies have also begun to discuss comprehensive collaboration in development, such as design environments and product development, as well as collaboration in manufacturing to achieve more efficient use of capital investment and increase capacity utilization rates.
Toshiba and NEC Electronics expect the joint effort to reduce development burdens and to shorten turn-around times for highly advanced system LSI. Toshiba sees future increases in utilization rates at its most advanced system LSI production facility, while NEC Electronics expects to focus on the development of value-added system LSI products, by focusing on differentiated process technologies.