This newly developed solar module makes effective use of compact semiconductor packaging technology to achieve a thickness of just 0.8 mm, the thinnest level in the industry. The solar cells that make up the module are based on polycrystalline silicon and deliver a maximum power of 300 mW , and as an auxiliary power source for mobile devices, will contribute to saving energy. In addition, the electrode pattern on the cell surface can be formed to meet the requirements of device manufacturers, leading to increased design flexibility for mobile devices.
Sharp plans to start mass production of the new module in July, with monthly production to reach the 100,000 units. Samples are available from today, for 3,000 yen.
Power output (max.): 300 mW (typ.)
Output voltage (max.): 4.5 V (typ.)
Load current (max.): 67 mA (typ.)
Dimensions: 67.5 x 41.0 x 0.8 mm