Venturing into the semiconductor packaging business, the company has been renovating production lines of Samsung Display Co. located in Cheonan in the northeast corner of South Chungcheon Province for the purpose. It joined up with Samsung Electronics to develop a new packaging technology called Fan out Wafer Level Package (FoWLP).
The fan-out packaging technology is advanced form that can be used for multiple die and since it does not require substrate and can be done in a foundry, it can significantly reduce the cost in chip-making and the area of packaging. The technology is patented by Taiwan-based Taiwan Semiconductor Manufacturing Company (TSMC). TSMC provides the entire supplies of application processor A10 chip, a core part of Apple’s iPhone 7.