Corning's latest glass substrates for the semiconductor industry is an enhanced line of glass carrier wafers optimized for fan-out processes.
The Advanced Packaging Carriers are a type of semiconductor packaging that enables smaller, faster chips for consumer electronics, automobiles, and other connected devices.
The glass specialist says that the Advanced Packaging Carriers feature fine granularity in a wide range of available coefficients of thermal expansion (CTE), and high stiffness composition.
Corming says that fine granularity enables customers to more easily select the optimal CTE needed to minimize in-process warp, with precise CTE offerings helping reduce customers' development cycle time.
The new carriers' high stiffness compositions help further reduce in-process warp. Minimizing warp helps maximize the yield of packaged chips.
Cornign also said the new products feature rapid sampling availability, which contributes to reduced development time and enables customers to move to the mass production phase more quickly.