G.Skill has introduced new Trident Z DDR4-4600 dual-channel memory kit designed for Intel's Kaby Lake-X processors and Intel's X299 HEDT platforms.

The new extreme Trident Z DDR4 memory modules are based on Samsung's famous 8 Gb B-die memory ICs produced on their 20 nm fabrication process. G.Skill says it has chosen the "very best" DRAM chips in order to achieve high frequency and operate in the voltage of up to 1.5 Volts.

The DDR4-4600 CL19 DIMMs offer a 25% increase over DDR4 standard's default voltage of 1.2v. They operate above the DDR4 specification's original maximum 3200 MT/sec transfer rate. Despite the high voltage, G.Skill claims that the DIMMs do not have any overheating issues and it had run loads of burn-in tests to ensure stability and reliability. G.Skill has validated stable operation of its "extreme" Trident Z dual-channel kit at 4600 MT/s on Intel's Core i7-7740X (Kaby Lake-X) CPU and ASRock's X299 OC Formula motherboard.

The modules come with XMP 2.0 SPD profiles that will simplify their set up on all Intel X299 platforms.

G.Skill will offer its DDR4-4600/CL19 kit with all black and grey with white aluminum heatsinks.

The company will start selling its 16 GB (8 GBx2) DDR4-4600 CL19 23-23-43 memory kit late this month.