The LG G Flex2 curved smartphone will be equipped with 20nm-level LPDDR4 memory made by SK hynix, the Korean memory maker confirmed on Monday. The new 8Gb (Gigabit) LPDDR4 (Low Power DDR4) mobile DRAM solution works faster than 3200Mbps and operates at ultra low-voltage of 1.1V to enhance the power efficiency by 30% compared to the 1600Mbps, 1.2V LPDDR3 modules.

SK Group's semiconductor affiliate has been teamed up with LG Electronics for the development of the chips. LG Electronics confirmed that it has signed with the chipmaker to use the SK chips for its curved and budget smartphone ? the G Flex 2.

With four of the new LPDDR4, a device can sport the highest density backed by 4GB DRAM chips, which will better support ultra high-definition video recording and continuous shooting of high-resolution images.

SK hynix said that it has been in talks with major Chinese smartphone vendors over the use of the chips in upcoming flagship products.

Home rival Samsung Electronics said in December last year it started mass production of the same-spec LPDDR4.

Industry experts also expect that Apple's iPhone 6S and Samsung's Galaxy Note 4 are equipped with the LPDDR4.