Intel’s Embedded Multi-Die Interconnect Bridge Helps Chips ‘Communicate’ Faster
An Intel technology called EMIB (embedded multi-die interconnect bridge) is a complex multi-layered sliver of silicon no bigger than a grain of rice, which lets...
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An Intel technology called EMIB (embedded multi-die interconnect bridge) is a complex multi-layered sliver of silicon no bigger than a grain of rice, which lets...
The Intel SSD 665p has been released, featuring four bit per cell (QLC) NAND flash memory.
Compared to its succesor (660p), the 665p makes...
Intel is partnering with Mediatek to integrate 5G modems into its standard PC platforms.
Intel was initially speculated to create a 5G modem itself,...
Intel has published a letter to its customers and partners apologizing for ongoing CPU shipment delays.
The letter, from Intel’s EVP and GM of...
At Supercomputing 2019, Intel unveiled new additions to its data-centric silicon portfolio and an ambitious new software initiative.
Intel expanded on its existing technology portfolio...
After introducing the first inference benchmarks in June of 2019, today the MLPerf consortium released 595 inference benchmark results from 14 organizations....
Intel introduced the Stratix 10 GX 10M, the world’s highest capacity FPGA, a large chiplet package with 43.3 billion transistors.
The Stratix 10 GX...
Chipmakers AMD and Intel are geting ready to launch their respective high-end desktop Threadripper and Cascade Lake-X processors later this month, in a battle that...
Intel's PTK1, a development center in Petach Tikva, Israel, independently runs its various systems and functions, accumulating data, processing it and using artificial intelligence (AI)...
Nippon Telegraph and Telephone Corporation (NTT), Intel Corp. and Sony Corp. today announced that they will create a new industry forum, the Innovative Optical and...