Crucial announces HBM3 Gen2 memory
Crucial today revealed HBM3 Gen2 memory that according is the Industry’s fastest, highest-capacity HBM to advance generative AI innovation
Generative AI
Generative AI opens...
Viltrox Launches AF 16mm F1.8 L for Full Frame Casio to Release G-SHOCK with Minimalist Metal Design and Even Better Fit Logitech G325 LIGHTSPEED Delivers Comfort, Style, and Game-Ready Audio Samsung Launches Glasses-Free 3D Digital Signage Globally at ISE 2026 Levelplay Launches Combat Liquid HUD and Combat Liquid SE AIO CPU Coolers
Crucial today revealed HBM3 Gen2 memory that according is the Industry’s fastest, highest-capacity HBM to advance generative AI innovation
Generative AI
Generative AI opens...
SK hynix announced it has become the industry’s first to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity, currently the largest in...
SK hynix Inc. (or “the company”, www.skhynix.com) announced that it began mass production of HBM3, the world’s best-performing DRAM.
* HBM (High Bandwidth Memory):...
SK hynix's HBM3 uses over 8,000 TSVs per stack (i.e. over 100,000 TSVs in a 12-Hi stack) and can feature up to 12-Hi stack, which...
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version...