Toshiba will showcase its new BG series solid state drive (SSD) family featuring BiCS FLASH with 3-bit-per-cell TLC (triple-level cell) technology and Toshiba?s new single-package...

Western Digital has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. The company has started pilot production...

Toshiba is trying to challeng rival Samsung Electronics by manufacturing the first 64-layer 3D NAND flash memory chips in the third quarter of this year...

China plans to establish its first 3D NAND flash plant in Wuhan, the capital city of Hubei Province in central China, by investing US$24 billion...

The memory semiconductor industry is focusing on making facility investments in 3D NAND-Flash memory, as the demand for high-capacity smartphones or PCs is expected to...

SK Hynix, a latecomer in the NAND memory area, has been faster thann rivals Toshiba and Micron in the inotruduction of 3D NAND mass-production. Instead...

Following Samsung and Toshiba, Micron's first 3D NAND chips are coming this year and pomise to offer a big jump in capacity and speeds in...

At this week's International Solid-State Circuits Conference (ISSCC), both Micron and Samsung Electronics presented papers outlining their latest eforts in the NAND flash technology, with...

The demand for 3D NAND flash memory is expected to soar this year as it wil be used everywhere - from servers and SSDs to...

The migration to three-dimensional structures for flash memory has helped Micron Technology Inc.keep up with Moore's law, the company says. Speaking to EETimes, Kevin Kilbuck,...