SK Hynix Introduces First 72-Layer 3D NAND Flash
South Korea's No. 2 chipmaker SK hynix Inc. said Monday it has developed the first 72-layer 256Gb 3d NAND flash, which will be mass-produced...
Western Digital Releases New iNAND 7350 Storage Solution Built on 3D NAND
Western Digital enhances its SanDisk-branded mobile storage portfolio with the industry's highest capacity e.MMC-Based embedded flash drive - the 256GB iNAND 7350.
Leveraging...
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
Toshiba has today unveiled the latest addition in its line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device...
Western Digital Introduces First 512 Gigabit 64-Layer 3D NAND Chip
Western Digital has kicked off pilot production of the industry's densest 3D NAND flash chips, which stack 64 layers atop another and enable three...
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6
In 2017, Micron plans to ramp up production of their 64-layer second generation 3D NAND, start producing 1Y nm DRAM and also introduce GDDR6...
A Closer Look At SK Hynix's 3D NAND
TechInsights has explored SK Hynix's U-shaped NAND cell architecture and compares it with the 3D NAND approaches followded by Micron, Toshiba, Intel...
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
SK Hynix will be the second memory chip maker to mass-produce 48-stack 3D NAND flash memory chips starting from the end of the month, following...
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Toshiba today outlined a schedule for the construction of a new fabrication facility at Yokkaichi Operations in Mie, Japan, for expanded production of BiCS FLASH,...
Samsung to Start Making 64-layer 3-D Flash memory for Smartphones
Samsung Electronics plans to start producing a new generation of 3-D NAND flash memory for smartphones before the end of 2016. The South Korean electronics...
Micron Announces QuantX Branding For 3D XPoint Memory, Releases 3D NAND flash for Mobile Devices
At Flash Memory Summit 2016, Micron unveiled the Micron QuantX technology solutions that incorporates their 3D XPoint memory and announced sampling of its first 3D...
