SK Hynix Introduces First 72-Layer 3D NAND Flash
South Korea's No. 2 chipmaker SK hynix Inc. said Monday it has developed the first 72-layer 256Gb 3d NAND flash, which will be mass-produced...
Noctua introduces NH-L12Sx77 low-profile CPU cooler Canon opens up RF Mount, first Sigma and Tamron lenses announced LG Display to Mass Produce World´s First Gaming OLED Panel With Switchable Refresh Rate and Resolution Sony Electronics Introduces XAV-AX3700 Multimedia Car Receiver Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices
South Korea's No. 2 chipmaker SK hynix Inc. said Monday it has developed the first 72-layer 256Gb 3d NAND flash, which will be mass-produced...
Western Digital enhances its SanDisk-branded mobile storage portfolio with the industry's highest capacity e.MMC-Based embedded flash drive - the 256GB iNAND 7350.
Leveraging...
Toshiba has today unveiled the latest addition in its line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device...
Western Digital has kicked off pilot production of the industry's densest 3D NAND flash chips, which stack 64 layers atop another and enable three...
In 2017, Micron plans to ramp up production of their 64-layer second generation 3D NAND, start producing 1Y nm DRAM and also introduce GDDR6...
TechInsights has explored SK Hynix's U-shaped NAND cell architecture and compares it with the 3D NAND approaches followded by Micron, Toshiba, Intel...