Samsung's 5M-pixel CIS has a 1/2.5-inch lens aperture with a pixel measurement of 2.2 by 2.2 microns. Using 0.13-micron process technology, Samsung has increased the fill factor (the image sensor's measurement of light sensitivity) by over 50 percent.
The 5M-pixel CIS has a footprint at least 30 percent smaller than other models of the same resolution. This allows the camera module to be designed into ever-smaller camera phones.
A sub-sampling function that shoots VGA quality moving pictures at 30 frames per second with no deterioration of picture quality has also been incorporated to shoot faster high-resolution images. Power consumption has been minimized as well to prolong battery life.
Samsung has also completed development of a 3.2M-pixel CIS -- the S5K3C1FX -- for camera phones. Pixels measure 2.25 by 2.25 microns in a 1/3-inch lens aperture with serial interface applied for accelerated data processing speeds.
Samsung plans to begin mass-production of the 5M-pixel CIS in the fourth quarter of 2005 and the 3.2M-pixel CIS with an embedded image signal processor (ISP) by the first half of 2006. Both at its 300mm System LSI dedicated mass production line.