H L Data Storage Store Banner 970x90
Breaking News

MSI and Asus announces X670E motherborads AMD introduces Ryzen 7000 series, new chipsets and technologies CORSAIR introduce VOYAGER a1600 Gaming & Streaming Laptop AMD Advantage Edition Phison Announces Strategic PCIe Gen5 Relationship with AMD and Micron at Computex 2022 Apacer Unveils COMPUTEX 2022 Event Series

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Samsung and Xilinx Team Up for 5G Commercial Deployments

Samsung and Xilinx Team Up for 5G Commercial Deployments

Enterprise & IT Apr 16,2020 0

Samsung Electronics Co., Ltd., will use the Xilinx Versal adaptive compute acceleration platform (ACAP) for worldwide 5G commercial deployments.

Financial terms of the deal between Samsung and Xilinx were undisclosed.

Xilinx Versal ACAPs provide a universal and scalable platform that can address multiple operator requirements across multiple geographies.

“Samsung has been working closely with Xilinx, paving the way for enhancing our 5G technical leadership and opening up a new era in 5G,” said Jaeho Jeon, executive vice president and head of R&D, Networks business, Samsung Electronics. “Taking a step further by applying Xilinx’s new advanced platform to our solutions, we expect to increase 5G performance and accelerate our leadership position in the global market.”

Versal ACAP – a highly-integrated, multicore, heterogeneous compute platform – operates at the heart of 5G to perform the complex, real-time signal processing, including the beamforming techniques used to increase network capacity.

5G requires beamforming, which allows multiple data streams to be transmitted simultaneously to multiple users using the same spectrum. This is what enables the dramatic increase in 5G network capacity. Beamforming technology, however, requires significant compute density and advanced high-speed connectivity – on-chip and off-chip – to meet 5G’s low-latency requirements. Adding to this, different system functional partition requirements and algorithm implementations lead to a wide range of processing performance and compute precision. It is extremely challenging for traditional FPGAs to optimally address this requirement while meeting thermal and system footprint constraints.

Versal ACAPs offer compute density at low power consumption to perform the real-time, low-latency signal processing demanded by beamforming algorithms. The AI Engines, which are part of the Versal AI Core series, are comprised of a tiled array of vector processors, making them ideal for implementing the required mathematical functions offering high compute density, advanced connectivity, as well as the ability to be reprogrammed and reconfigured even after deployment.

The first Versal ACAP devices have been shipping to early access customers and will be generally available in the Q4 2020 timeframe.

Tags: 5GXilinxSAMSUNG
Previous Post
PlayStation 5 Output is Expected to be Limited in First Year
Next Post
Google to Slow Hiring in 2020: CEO

Related Posts

  • Samsung Electronics Showcases New Era of Micro LED Technology at ISE 2022

  • Samsung Electronics Introduces Industry’s First 512GB CXL Memory Module

  • Samsung Unveils 6G Spectrum White Paper and 6G Research Findings

  • Samsung Unveils New PRO Endurance Memory Card Optimized for Surveillance and Dashboard Cameras

  • Samsung’s Rugged T7 Shield Portable SSD Offers Durability and Fast Sustained Performance for Creative Professionals and Consumers On-the-Go

  • Samsung and Western Digital Collaborate To Kindle More Robust Data Storage Ecosystems

  • Samsung Electronics Hosts Its First-Ever 6G Forum To Explore the Next-Gen Communications Technologies

  • Samsung and Western Digital Begin Far-reaching Collaboration to Drive Standardization of Next-generation Storage Technologies

H L Data Storage Store Banner 300x600

 

Latest News

MSI and Asus announces X670E motherborads
PC components

MSI and Asus announces X670E motherborads

AMD introduces Ryzen 7000 series, new chipsets and technologies
Enterprise & IT

AMD introduces Ryzen 7000 series, new chipsets and technologies

CORSAIR introduce VOYAGER a1600 Gaming & Streaming Laptop AMD Advantage Edition
Gaming

CORSAIR introduce VOYAGER a1600 Gaming & Streaming Laptop AMD Advantage Edition

Phison Announces Strategic PCIe Gen5 Relationship with AMD and Micron at Computex 2022
Enterprise & IT

Phison Announces Strategic PCIe Gen5 Relationship with AMD and Micron at Computex 2022

Apacer Unveils COMPUTEX 2022 Event Series
Enterprise & IT

Apacer Unveils COMPUTEX 2022 Event Series

Popular Reviews

CeBIT 2005

CeBIT 2005

CeBIT 2006

CeBIT 2006

Zidoo Z9S 4K Media Player review

Zidoo Z9S 4K Media Player review

LiteOn iHBS112 review

LiteOn iHBS112 review

Club3D HD3850

Club3D HD3850

Pioneer BDR-2207 (BDR-207M) BDXL burner review

Pioneer BDR-2207 (BDR-207M) BDXL burner review

External USB Slim Recorders Comparison

External USB Slim Recorders Comparison

Crucial P1 NVMe 1TB SSD review

Crucial P1 NVMe 1TB SSD review

  • Home
  • News
  • Reviews
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed