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Qualcomm to Redesign Snapdragon 810 To Cope With Overheating Issues: reports

Qualcomm to Redesign Snapdragon 810 To Cope With Overheating Issues: reports

Smartphones Jan 27,2015 0

Qualcomm will reportedly redesign its Snapdragon 810 application processor which is embroiled in an overheating controversy. The world's number one AP maker is said to be planning to address the problem by March at the latest, which is aimed at meeting the launch date of the Galaxy S6, possibly at the the MWC 2015 to be held in March.

On the otehr hand, Samsung has already developed its own Exynos chips and some industry observers believe that it is possible for the firm to use Exynos chips in the Galaxy S6.

LG Electronics, on the other hand, has featured the controversial chips in the G Flex 2 for the first time, which is scheduled to be introduced to the nation late this month.

"We did not find any problem with the Snapdragon 810," said a LG official during a launch event for the G Flex 2 held on Jan. 22.

Tags: Qualcomm
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G.SKILL Announces T5 Neo Series DDR5-6400 CL38 512GB (64GBx8) Overclocked R-DIMM Memory Kit with AMD EXPO Support for AMD Ryzen Threadripper PRO Workstations
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