Breaking News

Razer Unveils the Ultra-Lightweight DeathAdder V4 Pro Sony launches a high-resolution shotgun microphone with superior sound quality and compact design. Arctic announces New Liquid Freezer III Pro 280 and Pro 420 Silicon Power Launches Hypera microSDXC Express Card Samsung announces Watch8, Z Fold7 and Z Flip7

logo

  • Share Us
    • Facebook
    • Twitter
  • Home
  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map

Search form

Intel, Ericsson Expand Collaboration to Advance Next-Gen Optimized 5G Infrastructure

Intel, Ericsson Expand Collaboration to Advance Next-Gen Optimized 5G Infrastructure

Smartphones Jul 26,2023 0

Intel announced a strategic collaboration agreement with Ericsson to utilize Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.

As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to optimize 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost for Ericsson’s Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.

“As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology,” said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. “We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future.”

18A is Intel's most advanced node on the company's five-nodes-in-four-years roadmap. After new gate-all-around transistor architecture – known as RibbonFET – and backside power delivery – called PowerVia – appear first in Intel 20A, Intel will deliver ribbon architecture innovation and increased performance along with continued metal linewidth reduction in 18A. Combined, these technologies will put Intel back in the process leadership position in 2025, elevating future offerings its customers bring to market.

“Ericsson has a long history of close collaboration with Intel, and we are pleased to expand this further as we utilize Intel to manufacture our future custom 5G SoCs on their 18A process node, which is in line with Ericsson’s long-term strategy for a more resilient and sustainable supply chain,” said Fredrik Jejdling, executive vice president and head of Networks at Ericsson. “In addition, we will be expanding our collaboration that we announced at MWC 2023 to work together with the ecosystem to accelerate industry-scale open RAN utilizing standard Intel Xeon-based platforms.”

The future is open and scalable

As 5G deployments continue, the future lies in fully programmable, open software-defined networks powered by the same cloud-native technologies that transformed the data center, delivering unparalleled agility and automation.

To realize the best performance, innovation and global scale, the industry needs to work together and continue to synchronize network specifications as part of one global set of standards. Intel and Ericsson collaborate with other leading technology companies to bring these benefits to their customers toward industry-scale open RAN.

Tags: IntelEricsson5G
Previous Post
Samsung Galaxy Watch6 and Galaxy Watch6 Classic
Next Post
Thermaltake Announces the SWAFAN EX12/ EX14 ARGB PC Cooling Fan

Related Posts

  • An Intel-HP Collaboration Delivers Next-Gen AI PCs

  • New Intel Xeon 6 CPUs to Maximize GPU-Accelerated AI Performance

  • Intel Unveils New GPUs for AI and Workstations at Computex 2025

  • G.SKILL Releases DDR5 Memory Support List for Intel 200S Boost

  • Intel and its partners release BIOS update for Intel 15th Gen to increase performance

  • Intel-AMD new motherboards announced

  • Intel at CES 2025

  • Intel Launches Arc B-Series Graphics Cards

Latest News

Razer Unveils the Ultra-Lightweight DeathAdder V4 Pro
PC components

Razer Unveils the Ultra-Lightweight DeathAdder V4 Pro

Sony launches a high-resolution shotgun microphone with superior sound quality and compact design.
Cameras

Sony launches a high-resolution shotgun microphone with superior sound quality and compact design.

Arctic announces New Liquid Freezer III Pro 280 and Pro 420
Cooling Systems

Arctic announces New Liquid Freezer III Pro 280 and Pro 420

Silicon Power Launches Hypera microSDXC Express Card
Cameras

Silicon Power Launches Hypera microSDXC Express Card

Samsung announces Watch8, Z Fold7 and Z Flip7
Smartphones

Samsung announces Watch8, Z Fold7 and Z Flip7

Popular Reviews

be quiet! Light Loop 360mm

be quiet! Light Loop 360mm

be quiet! Dark Mount Keyboard

be quiet! Dark Mount Keyboard

be quiet! Light Mount Keyboard

be quiet! Light Mount Keyboard

Noctua NH-D15 G2

Noctua NH-D15 G2

Soundpeats Pop Clip

Soundpeats Pop Clip

be quiet! Light Base 600 LX

be quiet! Light Base 600 LX

Crucial T705 2TB NVME White

Crucial T705 2TB NVME White

be quiet! Pure Base 501

be quiet! Pure Base 501

Main menu

  • Home
  • News
  • Reviews
  • Essays
  • Forum
  • Legacy
  • About
    • Submit News

    • Contact Us
    • Privacy

    • Promotion
    • Advertise

    • RSS Feed
    • Site Map
  • About
  • Privacy
  • Contact Us
  • Promotional Opportunities @ CdrInfo.com
  • Advertise on out site
  • Submit your News to our site
  • RSS Feed