SK Hynix Inc. has started full-scale mass production of 16nm 64Gb (Gigabit) MLC (Multi Level Cell) NAND Flash. SK Hynix has been mass producing its 1st version of its 16nm NAND Flash since June and recently has started to mass produce the 2nd version, which is more cost competitive due to its smaller chip size.

SK Hynix has also developed 128Gb (16-gigabytes, 16GB) MLC chips based on the specification and endurance of 16nm 64Gb MLC, with mass production scheduled for early 2014, the company noted.

Generally, the thinner process technology shrinks the more frequent interferences among cells occur, but SK Hynix applied up-to-date Air-Gap technology to overcome the interferences among the cells, the company says. The Air-Gap technology builds insulation shield with vacuum holes between circuits not with insulating substances.

SK hynix also plans to accelerating the development of TLC (Triple Level Cell) and 3D NAND Flash.