Hiroshima Elpida Starts Mass Production of 90 nm DRAM Chips on New 300 mm Wafer Production Line
Newly expanded E300 fab targets 54,000 wafers per month, the largest semiconductor capacity in Japan.
Elpida Memory and Hiroshima Elpida Memory, announced today the completion of its new 300 mm production line at its 300 mm wafer fabrication facility (E300 Fab) in Hiroshima, Japan.
The monthly 300 mm wafer production volume is expected to reach a capacity of 54,000 by FY Q4, which would make Hiroshima Elpida's E300 Fab the largest semiconductor wafer processing capacity in Japan.
In FY Q2, the E300 Fab started an average of 30,000 wafers per month. In November 2005, the E300 Fab handled 45,000 wafers per month, and during December 2005, volume is expected to increase to 50,000 wafers per month. Wafer output will likely contribute to shipments starting in 4Q of the current fiscal year ending March 31.
The monthly 300 mm wafer production volume is expected to reach a capacity of 54,000 by FY Q4, which would make Hiroshima Elpida's E300 Fab the largest semiconductor wafer processing capacity in Japan.
In FY Q2, the E300 Fab started an average of 30,000 wafers per month. In November 2005, the E300 Fab handled 45,000 wafers per month, and during December 2005, volume is expected to increase to 50,000 wafers per month. Wafer output will likely contribute to shipments starting in 4Q of the current fiscal year ending March 31.
