G.SKILL announced new high-capacity, high-performance memory kit specifications based on 32GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256GB (32GBx8), Trident Z Royal DDR4-4000 CL18 128GB (32GBx4), Trident Z Neo DDR4-3600 CL18 128GB (32GBx4), and Trident Z Neo DDR4-3800 C18 64GB (32GBx2).
Built with the latest high-density 16Gb components, these DDR4 memory kits are a good choice for pushing the performance limits of high memory capacity.
With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32GB for a total of 256GB. The Trident Z Royal DDR4-3200 CL16 256GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor.
High capacity 32GB modules are no slouch when it comes to high frequency, breaking through DDR4-4000 CL18 with 128GB (32GBx4) with the ASUS ROG Rampage VI Extreme Encore motherboard and Intel Core i9-9820X processor, according to G.SKILL.
Even without a HEDT system, it's now possible to reach a total of 128GB on current 4-DIMM motherboards. Under the AMD-optimized Trident Z Neo series, the Trident Z Neo DDR4-3600 CL18 128GB (32GBx4) has been successfully being stress-tested on the MSI MEG X570 GODLIKE motherboard and the AMD Ryzen 5 3600 processor.
At the extreme limits of AMD Ryzen 3000 platform, G.SKILL is also releasing a dual-module behemoth kit of 64GB (32GBx2) at DDR4-3800 CL18 under the Trident Z Neo series, validated on the MSI MEG X570 GODLIKE motherboard and AMD Ryzen 9 3900X processor.
These memory specifications will support the latest Intel XMP 2.0 for easy overclocking and will be available via G.SKILL distribution partners in Q4 2019.