SK Hynix Inc. has developed the first 8Gb (Gigabit) LPDDR3 (Low Power DDR3) using its 20nm class process technology. The new products can be stacked up and realize a high density of maximum 4GB (Gigabytes, 32Gb) solution in a single package. In addition, the height of this package becomes thinner than the existing 4Gb-based one.

The mobile memory solution works at 2133Mbps, which surpasses the 1600Mbps of existing LPDDR3 in terms of data transmission speed. With a 32-bit I/O the memory processes up to 8.5GB of data per second in a single channel, and 17GB in a dual channel. It also works at ultra low-voltage of 1.2V.

While this new LPDDR3 runs two times faster than LPDDR2, its standby power consumption is more than 10% lower than LPDDR2 products.

SK Hynix is offering the LPDDR3 in various forms including 'PoP' (Package on Package), in a single package with 'eMMC' (embedded Multi Media Card) for mobile gadgets or as 'On-board' type embedded in high-end ultrabooks and tablets.

SK Hynix has started sampling the memory, which will enter mass productionat the end of this year.

High density LPDDR3 memory products over 2GB are expected to be found mainly on high-end mobile devices from the second half of this year.