BinOptics eyes read-only HD DVD market
BinOptics claims that its etched-facet technology should cut the cost of 405 nm lasers for HD DVD applications by delivering higher yields and reducing testing and packaging costs.
BinOptics, a US company that manufactures InP-based etched-facet lasers, intends to widen its product portfolio by offering GaN-based 405nm lasers for read-only applications in high denfinition (HD) DVD players.
Although the first-products will be edge-emitting lasers, we plan to develop a surface-emitting blue laser using the horizontal-cavity surface-emitting laser (HCSEL) technology in the future, said BinOptics VP of technology development Alan Morrow.
BinOptics HCSEL chip technology integrates a horizontal laser cavity with a 45° etched reflecting mirror to direct the beam vertically.
According to Morrow, for 405 nm applications the HCSEL technology enables compact integrated device design, and reduces optical head packaging costs.
Substantial cost-savings are anticipated through the elimination of cleaving-related defects and losses, higher yield, reduced testing costs, optimized laser design, and reduced packaging through integration, continued Morrow.
Yield is increased by reducing the cavity length and consequently the number of defects. According to Morrow, GaN lasers with cleaved facets have cavity lengths of about 600 ΅m, but lasers with etched facets have cavity lengths of 60 ΅m or less.
Although production of laser-quality etched facets demanded several significant changes to BinOptics InP process, all the required modifications have been demonstrated in GaN devices.
Although the first-products will be edge-emitting lasers, we plan to develop a surface-emitting blue laser using the horizontal-cavity surface-emitting laser (HCSEL) technology in the future, said BinOptics VP of technology development Alan Morrow.
BinOptics HCSEL chip technology integrates a horizontal laser cavity with a 45° etched reflecting mirror to direct the beam vertically.
According to Morrow, for 405 nm applications the HCSEL technology enables compact integrated device design, and reduces optical head packaging costs.
Substantial cost-savings are anticipated through the elimination of cleaving-related defects and losses, higher yield, reduced testing costs, optimized laser design, and reduced packaging through integration, continued Morrow.
Yield is increased by reducing the cavity length and consequently the number of defects. According to Morrow, GaN lasers with cleaved facets have cavity lengths of about 600 ΅m, but lasers with etched facets have cavity lengths of 60 ΅m or less.
Although production of laser-quality etched facets demanded several significant changes to BinOptics InP process, all the required modifications have been demonstrated in GaN devices.
