Next week at International CES 2018, Toshiba Memory will be highlighting the use of its BiCS FLASH 3D memory in several applications - including its new lineup of NVMe SSDs, the RC100 Series.
Toshiba was the first company in the world1 to announce 3D flash memory technology, which addresses the processing, storage and management of the growing volume of data generated worldwide. Recent announcements include the introduction of a 96-layer 512Gb die; the debut of the first flash memory device with quadruple-level cell (QLC) technology; and the addition of Through Silicon Via (TSV) technology.
Harnessing the 64-layer BiCS FLASH 3D memory, Toshiba's latest RC100 Series sits right in the sweet spot between SATA SSDs and higher-end NVMe SSDs. The new Series was designed to address the entire spectrum of computing - and make the benefits of NVMe accessible to the mainstream market.
Toshiba's RC100 M.2 NVMe SSD Series has been built from the ground up to deliver faster-than-SATA performance in a cost-effective and power-optimized solution for today's DIY builders and PC gamers. It comes in a small 22x42mm form factor, low power consumption, high performance and an affordable price.
Also at CES, the Toshiba will demonstrate its small, ruggedized external SSD. The new XS700 incorporates Toshiba's BiCS FLASH technology and was designed with portability and affordability in mind.