Samsung is now mass producing the first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory’s UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

UFS has a LVDS (Low-Voltage Differential Signaling) serial interface which has separately dedicated read/write paths. This allows full duplex (two-way interaction) – in other words UFS can read and write simultaneously. eMMC, on the other hand, has a parallel interface which can only send data in one direction at a time – it can either read or write, not at the same time.

UFS memory also utilizes "Command Queue," a technology that accelerates the speed of command execution in SSDs through a serial interface, significantly increasing data processing speeds compared to the 8-bit parallel-interface-based eMMC standard.

As a result, Samsung UFS memory conducts 19,000 input/output operations per second (IOPS) for random reading, which is 2.7 times faster than the most common embedded memory for high-end smartphones today, the eMMC 5.0. It also delivers a sequential read and write performance boost up to SSD levels, in addition to a 50 percent decrease in energy consumption. In addition, the random read speed is 12 times faster than that of a typical high-speed memory card (which runs at 1,500 IOPS).

In the future, Samsung anticipates that UFS will support high-end mobile market needs, while eMMC solutions remain viable for the mid-market, value segments.

For random writing of data to storage, the UFS embedded memory operates at 14,000 IOPS and is 28 times as fast as a conventional external memory card, making it capable of supporting Ultra HD video playback and multitasking functions at the same time.

Samsung’s new UFS embedded memory comes in 128GB, 64GB and 32GB versions, which are twice the capacity of its eMMC line-up.

In an attempt to provide more design flexibility to global customers, Samsung’s UFS embedded memory package, a new ePoP (embedded package on package) solution, can be stacked directly on top of a logic chip, taking approximately 50 percent less space.