Samsung Unveils UFS 5.0
Samsung Electronics announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will...
JEDEC announces Universal Flash Storage (UFS) 4.0 specs
JEDEC Solid State Technology Association announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard,...
Samsung Electronics Unveils Far-Reaching, Next-Generation Memory Solutions at Flash Memory Summit 2022
Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held...
JEDEC Updates the Universal Flash Storage (UFS) Standard
JEDEC Solid State Technology Association has made available the Universal Flash Storage (UFS) version 3.1, JESD220E.
In addition, an optional new companion standard, JESD220-3:...
Toshiba Unveils First UFS Ver. 3.0 Embedded Flash Memory Devices
Toshiba Memory has started sampling the first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices.
The new lineup utilizes the company’s 96-layer BiCS...
Western Digital Releases New 3D NAND UFS Embedded Flash Drive For Connected Cars
Addressing the demand of advanced automotive systems such as Advanced Driver-Assistance Systems (ADAS) and autonomous vehicles, Western Digital today introduced the first 3D TLC NAND...
Samsung Begins Production of 256GB Embedded Universal Flash Storage for Autos
Samsung has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with features based on automotive specifications from the JEDEC...
Samsung Starts Producing 512-Gigabyte Universal Flash Storage for Mobile Devices
Samsung Electronics has begun mass production of the first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices.
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Toshiba Launches New e•MMC and UFS Memories with Updated Controllers
Toshiba has launched new e•MMC and UFS NAND flash embedded memories that use enhanced integrated controller technologies to deliver significant read and write speed improvements...
SK Hynix Challenges Samsung With Mass Production Of UFS 2.1 3D Memory Solution
SK Hynix has tapped into the next-generation mobile-use memory chip market that has been exclusively dominated by its rival Samsung Electronics by introducing its own...
