Samsung begins making world's highest-capacity MCP chip
Samsung Electronics said Tuesday it has begun mass production of the world's
highest-capacity multi-chip (MCP) package for high-end mobile phones.
With two 1-gigabit NAND flash memory chips and two other dynamic random access memory
chips, the new MCP chip has a combined capacity of 2.5 gigabits in a package, the company
said in a statement.
The new chip will allow mobile phone users to store about four hours of moving images in their handsets.
Samsung, which is also the world's No. 3 mobile phone maker, said it plans to develop an 8-gigabit MCP chip this year.
Multi-chip package products, popular in high-end mobile phones and other digital devices that require advanced memory capability, are manufactured by combining different types of memory chips in one chip.
The new chip will allow mobile phone users to store about four hours of moving images in their handsets.
Samsung, which is also the world's No. 3 mobile phone maker, said it plans to develop an 8-gigabit MCP chip this year.
Multi-chip package products, popular in high-end mobile phones and other digital devices that require advanced memory capability, are manufactured by combining different types of memory chips in one chip.
