Chinese YMTC Introduces 128-Layer 1.33Tb QLC 3D NAND
Yangtze Memory Technologies Co., Ltd (YMTC) announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on a SSD...
Yangtze Memory to Release its 128-layer 3D NAND This Year
Yangtze Memory is still on track to launch its most advanced 128-layer 3D NAND this year, despite the delays in the research and development progress...
China IC Production Forecast to Double Over Next 5 Years
Integrated circuit production in China is projected to nearly double between 2018 and 2023, increasing from $23.8 billion to $47 billion, according to market research...
Foxconn to Invest $9bn in China Chip Project: report
Foxconn Technology will reportedly launch an $9 billion chip-making project in China as tensions intensify between Washington and Beijing.
The Taiwan-based company, formally trading as...
China Breaks Ground In First 200mm Wafer Semiconductor Equipment Verification Line
The groundbreaking ceremony for China’s first ‘200mm wafer semiconductor equipment verification line’ was held in Changsha High-tech Zone, Changsha, Hunan Province, late last month.
The...
GLOBALFOUNDRIES and China's Chengdu Realign Joint Venture Strategy to Include 22FDX Technology
GLOBALFOUNDRIES and the Chengdu municipality signed an amendment to their investment and cooperation agreement today, in line with GF's recently announced shift to its technology...
Possible US Export Controls Threaten China's Burgeoning Chip Industry
Restrictions on U.S. exports of equipment and materials would deal a severe blow to China's ambitions to build a domestic semiconductor industry.
Although it is...
