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Toshiba Expands Line-up of eMMC Version 5.1 Embedded NAND Flash Memory Products

Toshiba Expands Line-up of eMMC Version 5.1 Embedded NAND Flash Memory Products

Smartphones Mar 24,2015 0

Toshiba is launching the JEDEC eMMCTM Version 5.1compliant embedded NAND flash memory products supporting "command queuing" and "secure write protection". The new products integrate NAND chips fabricated with 15nm process technology and are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices.

The new products integrate NAND chips fabricated with a controller to manage basic control functions for NAND applications in a single package. In October 2014, Toshiba launched the first eMMC products supporting all mandatory features of JEDEC eMMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of eMMC Version 5.1, "command queuing" and "secure write protection".

The "command queuing feature" allows users to process multiple tasks generated by the user's issue of multiple commands, in the order of the user's preference, by initially storing the tasks in a waiting queue. It improves random read performance speed by approximately 30% at maximum compared to Toshiba existing products. It effectively improves the user experience when simultaneously executing multiple applications on mobile devices, including smartphones and tablets.

The "secure write protection feature" expands the conventional write protect feature and protects the user's data stored in an assigned area from being overwritten or erased by unauthenticated users.

The Japanese company has started sample shipments of the 16GB and 64GB products, with 32GB and 128GB products to follow.

Model Capacity Category Package Mass Production
THGBMHG7C2LBAIL 16GB Supreme 11.5x13x0.8mm 2Q, 2015 (Apr.-Jun.)
THGBMHG8C4LBAIR 32GB 11.5x13x1.0mm 2Q, 2015 (Apr.-Jun.)
THGBMHG9C8LBAIG 64GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)
THGBMHT0C8LBAIG 128GB 11.5x13x1.2mm 2Q, 2015 (Apr.-Jun.)

 

Key Specifications

Interface

JEDEC e∙MMC Version 5.1 standard

HS-MMC interface

Capacity 16GB, 32GB, 64GB, 128GB
Power Supply Voltage

2.7-3.6V (Memory core)

1.7V-1.95V, 2.7V-3.6V (Interface)

Bus Width x1, x4, x8
Temperature Range -25oC to +85oC
Package 153Ball FBGA - 11.5mm x 13.0mm


Tags: eMMCToshiba
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