Citing industry sources, Korean ETNews.com reports that Samsung has been co-developing EMI shielding process that uses spray method with Protec, a South Korean company specializing in dispenser, Asymtek, Hansol Chemical, and Ntrium.
Hansol Chemical and Ntrium are developing an EMI masking material that is in a form of ink. Samsung is planning to supply NAND-Flash package with EMI shield to Apple as soon as next year, according to the report.
NAND-Flash memories that were used for previous iPhones used an LGA (Land Grid Array) packaging.
SK Hynix has also asked Taiwans’ ASE to supply NAND-Flash chip packaging for Apple. It is heard that SK Hynix is developing a same solution as Samsung Electronics.
EMI shielding allows for denser forming on circuit boards, potentially leaving free area that can be used i.e for a larger battery into a smartphone.
Apple has been using EMI shielding technology for NAND-Flash packaging products that have a controller. The commpany plans to expand EMI shielding technology to most of chips starting from iPhone 7 that is set for release this year.